Tellurium metal

Tellurium sputtering target is a key material that is widely used in semiconductor, electronics, optics and other fields by sputtering tellurium atoms and depositing them on the surface of the substrate to form a thin film by bombardment with a stream of ion beams in a high vacuum environment.

VIMATERIAL offers high-purity tellurium metal sputtering targets, and can customize different sizes to meet your needs. Contact us for more information.

Characteristics

Appearance: Grey.

Density: Theoretical density is about 6.25 g/cm³, high density is important for the uniform sputtering of atoms and the uniform deposition of thin films in the sputtering process.

Melting point: The melting point is 450°C. The relatively moderate melting point allows the target to maintain solid state stability during sputtering and to achieve sputtering of atoms at a certain energy level.

Thermal conductivity: The thermal conductivity is 1.97~3.0 W/m Kelvin, the size of thermal conductivity affects the heat transfer and temperature distribution of the target material during the sputtering process, which has a certain influence on the stability of sputtering and the quality of the film.

Chemical stability: As a sputtering target, it can maintain good chemical stability under suitable sputtering environments (e.g., high vacuum, inert gas protection, etc.) to ensure that the purity and quality of the film will not be affected by chemical reactions with other substances during the sputtering process.

Purity characteristics: Generally up to 99.99% or even 99.999%. High purity can ensure the purity of the sputtered tellurium atoms, so that the deposited film has good electrical and optical properties, and meets the high requirements of semiconductor, electronics, optics and other fields on thin film materials.

Crystal structure properties: Tellurium exists in two isotopes, crystalline and amorphous states. The crystal structure affects the sputtering direction and energy distribution of atoms during the sputtering process, which in turn affects the microstructure and properties of the film.

Sputtering uniformity: high-quality tellurium metal sputtering target should have good sputtering uniformity, so that the deposited film on the entire substrate surface thickness and performance distribution is uniform.

Bonding characteristics: the bonding strength with the backing material (such as copper, aluminium, etc.) is also one of the important characteristics. Good bonding characteristics can ensure that the target will not be separated from the backing material during the sputtering process, which will affect the stability of sputtering and the quality of the film.

Applications of Tellurium Sputtering Target

Solar Cells: Tellurium sputtering targets are widely used in CdTe thin-film solar cells and CIGS solar cells to deposit or dope functional layers, helping improve film quality, conversion efficiency, and overall device performance.

Semiconductor Field: Used in integrated circuit manufacturing and advanced memory devices such as phase change memory (PCM) to form dopant, barrier, insulating, or phase-change thin films that enhance device performance and reliability.

Thermoelectric Applications: Employed to prepare tellurium-based thermoelectric thin films that efficiently convert heat into electricity for waste heat recovery and power generation.

Optical & Display Field: Applied in optical coatings, infrared detectors, and flat panel displays to form functional thin films that improve light transmission, infrared sensitivity, and device efficiency and stability.

Packaging and Storage

Tellurium sputtering targets are vacuum-sealed in moisture-proof plastic or aluminum foil bags, cushioned with protective foam or padding, and packed in sturdy cartons or wooden cases to prevent moisture, oxidation, and mechanical damage during transportation, ensuring a clean surface and structural integrity.

Tellurium sputtering targets should be store in a cool, dry, clean, and well-ventilated environment, away from humidity, high temperatures, and corrosive gases. Keep the package tightly sealed and avoid frequent exposure to air to prevent oxidation or contamination, maintaining stable performance and extended service life.