Product ID | Formula | Purity | Dimension | Quantity | Price in € | Inquiry |
---|---|---|---|---|---|---|
5000ST001 | Sn | 99.99% | Ø 50.8 mm x 3.175 mm | 1 | 205.00 | Inquire |
5000ST002 | Sn | 99.99% | Ø 50.8 mm x 6.35 mm | 1 | 229.00 | Inquire |
5000ST003 | Sn | 99.99% | Ø 76.2 mm x 3.175 mm | 1 | 229.00 | Inquire |
5000ST004 | Sn | 99.99% | Ø 76.2 mm x 6.35 mm | 1 | 263.00 | Inquire |
5000ST005 | Sn | 99.99% | Ø 101.6 mm x 3.175 mm | 1 | 263.00 | Inquire |
5000ST006 | Sn | 99.99% | Ø 101.6 mm x 6.35 mm | 1 | 313.00 | Inquire |
Tin metal sputtering target is a material made of high purity tin metal for physical vapour deposition technology. It usually has a silvery grey metallic appearance and is capable of depositing a thin film of tin during the sputtering process, which is widely used in the fields of electronics, packaging, chemical industry and many other areas.
Characteristics
Appearance: Silver grey solid with metallic luster.
Atomic weight: 118.71
Atomic number: 50
Melting point: 232℃
Boiling point: 2602°C
Density: 7.265 – 7.31g/cm³(20℃)
Coefficient of thermal expansion: 22.0 µm/(m-K)(20℃)
Poisson’s ratio: 0.36
Young’s modulus: 50GPa
Specific heat capacity: 0.21J/(g-°C)(25°C)
Thermal conductivity: 66.8W/(m-K)
Electrical Properties: Resistivity: 11.5×10-⁸Ω・m, Electronegativity: 1.96 Paulings.
Applications
Electronics field:
Semiconductor manufacturing: In semiconductor chip manufacturing, metal tin sputtering targets are used to prepare interconnects and barrier films. With the continuous development of integrated circuit technology, the purity and performance requirements of semiconductor materials are becoming higher and higher, metal tin has become one of the important materials in semiconductor manufacturing due to its good conductivity and processability.
Electronic encapsulation: Electronic encapsulation is to encapsulate electronic components such as chips to protect them from the external environment and to achieve electrical connections. Metal tin sputtering targets can be used as welding materials in electronic packaging. For example, in flip chip packaging, metal tin balls are used as welding materials to connect the chip and the substrate, and their performance directly affects the quality and reliability of the package.
Optical field:
Low-E Glass Coating: Low-E glass is widely used in modern architectural design. This type of glass has good thermal insulating properties, which can block outside heat from entering the room in summer and maintain the room temperature in winter. Tin metal sputtering targets can be used to prepare coating materials for low-e glass. By coating a thin film of tin on the surface of the glass, the thermal insulation and optical properties of the glass can be improved.
Optical lens coating: In the manufacturing process of optical lenses, it is necessary to coat the lenses to improve their optical properties, such as increasing the light transmittance of the lenses and reducing reflections. Tin metal sputtering targets can be used to prepare coating materials for optical lenses, such as glasses lenses, camera lenses and other optical lenses coated with a layer of tin film, can improve the optical properties of the lens.
Energy field:
Solar cells: in the manufacture of solar cells, Tin metal sputtering targets can be used to prepare electrode materials for solar cells. For example, in crystalline silicon solar cells, tin metal films can be used as electrode materials to improve the photoelectric conversion efficiency and stability of the cell.
Lithium-ion battery: Lithium-ion battery is a high-performance secondary battery, which is widely used in mobile phones, laptop computers, electric vehicles and other fields. Tin metal sputtering targets can be used to prepare anode materials for lithium-ion batteries. Tin-based anode materials have high specific capacity and good cycling performance, and are one of the research hotspots for anode materials for lithium-ion batteries.
Other fields:
Coating materials: Tin metal sputtering targets can be used to prepare a variety of coating materials, such as wear-resistant coatings, anti-corrosion coatings, decorative coatings and so on. For example, a layer of tin film plated on the surface of mechanical parts can improve their wear resistance and corrosion resistance; a layer of metal tin film plated on the surface of metal products can make them have good decorative properties.
Superconducting materials: the alloy formed by tin metal and niobium and other metals can be used for superconducting materials. tin metal sputtering targets play an important role in the preparation of superconducting materials, and high-quality superconducting thin films can be prepared through the sputtering process and used in superconducting magnets, superconducting cables and other fields.
VI HALBLEITERMATERIAL GmbH (VIMATERIAL) employs a stringent quality assurance system to ensure the reliability of our product quality. Strict quality control is implemented throughout the entire production chain, and for defective products, we strictly enforce the principle of rework and redo. Each batch is released only after passing detailed specification tests.
Every batch of our materials is independently tested, and, if necessary, we send samples to certified companies for testing. We provide these documents and analysis certificates with the shipment to certify that our products meet the required standards.
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