How to make sputtering target?

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Sputtering targets are materials used for thin film deposition. Sputtering technology is used to sputter material atoms or molecules from solid targets and then form thin films on substrates. Sputtering targets are widely used in the electronics and information industries, including semiconductor chips, solar cells, flat panel displays, information storage and other fields.

Magnetron sputtering
Working Principle of Magnetron Sputtering

Sputtering target process flow

Raw material powder–powder smelting–powder mixing–pressing molding–atmosphere sintering–plastic processing–heat treatment–ultrasonic flaw detection–water cutting–machining–metallization–binding–ultrasonic testing–ultrasonic cleaning–inspection–shipping.

Among them, the specific meanings of the main processes are as follows:

Powder smelting: the raw material powder is subjected to preliminary atmosphere sintering to control the gas content in the raw material powder.

Powder mixing: the target material has a unique formula, and the content of each component needs to be accurately controlled, and the impurity content needs to be strictly limited. In the process of powder metallurgy, it is necessary to fully mix the elements evenly, and the particle size distribution is uniform to prevent pollution, and a mixed composite powder needs to be prepared by special process means.

Pressing molding: the target material prepared by powder metallurgy process needs to pre-press the powder material to make it a medium-density green body. Its density uniformity and internal defects affect the yield of high-temperature sintering in the later stage.

Atmosphere sintering: The pre-pressed green body needs to undergo one or more high-temperature sintering. Different sintering temperature curves are selected according to different materials, and different sintering environments, such as sintering atmosphere and sintering pressure, are selected to prepare high-density target blanks.

Plastic processing: The metal billet needs to undergo a large plastic deformation to obtain sufficient length, width and thickness dimensions, and to allow the internal grains to undergo sufficient tensile deformation, thereby generating enough dislocations inside.  Heat treatment: After the metal billet undergoes a large plastic deformation, the heat treatment process is selected according to the characteristics of different materials, so that the metal material can be recrystallized and the internal stress of the material can be removed.

Ultrasonic flaw detection: After the target blank is processed, ultrasonic waves need to be used to check whether there are defects inside the material. After the target blank is bonded to the back plate, a water-immersion ultrasonic scanner needs to be used to detect the bonding layer to check whether the bonding area meets the standard.

Mechanical processing: The target blank needs to be processed by precise mechanical forming. The back plate used in combination with the target blank needs to have extremely high dimensional accuracy and mechanical strength due to its precise coordination with the coating equipment and high-pressure water cooling. The processing difficulty is relatively high, especially for the back plate with an internal circulation water channel. Due to the particularity of the material, the closed welding of the water channel is very difficult and requires a special welding process.

Metallization: Before the target blank and the back plate are bound, in order to enhance the metal wetting properties of the target material and the target material and the solder, the welding surface needs to be pre-treated so that a transition layer is plated on the surface.

Bonding: Most target materials cannot be directly installed for coating due to the physical or chemical properties of the material. Metal solder is needed to weld the target blank and the back plate together, and the effective bonding rate of the surface needs to reach a large area welding greater than 95%. The whole process needs to be carried out under high temperature and high pressure.

Zinc aluminum alloy (ZnAl)tube Sputtering Targets - VIMATERIAL
Rotary Sputtering Targets

SPUTTERING TARGET - MANUFACTURING PROCESS

The manufacturing process of targets commences with a unique process design, tailored to the performance and requirements of the intended downstream application. This process involves repeated plastic deformation and heat treatment, followed by mechanical processing, cleaning, drying, and vacuum packaging.

The predominant preparation methods for sputtering targets currently include the casting process and powder metallurgy process.

Preparation Process General Type Features
Smelting and casting process Vacuum induction melting
Vacuum arc melting
Vacuum electron bombardment smelting
Compared to the powder method, the alloy targets produced through smelting exhibit lower impurity content, particularly in terms of gas impurities, and are characterized by high energy and density. However, for alloys comprising metals with significant disparities in melting points and densities, achieving uniform composition in smelted alloy targets is generally challenging.
powder metallurgy process Hot pressing
Vacuum hot pressing
Hot isostatic pressure (HIP)
Obtaining a uniform, fine-grained structure is facilitated by this method, which also conserves raw materials and enhances production efficiency. The critical factors include: selecting high-purity, ultra-fine powder as the raw material; employing forming and sintering technologies capable of rapid densification to ensure the target’s low porosity and control the crystallization particle size; and rigorously controlling the introduction of impurity elements during the preparation process.
Extrusion process Hot extrusion
Cold extrusion
Warm extrusion
Mainly used to prepare metal and alloy rotating targets with good plasticity such as aluminum-copper-zinc-nickel-chromium alloy.
Plasma spraying process vacuum
Water stability
Gas stability
Plasma spraying
Mainly used to prepare brittle metal and alloy ceramic targets, such as metal chromium, silicon, silicon aluminum alloy, oxide and other rotating targets.

VI HALBLEITERMATERIAL GmbH offers an extensive range of high-purity, high-performance sputtering target materials, available in various shapes and compositions. Our inventory includes circular sputtering target, rectangular sputtering target, triangular sputtering target, planarsputtering target, rotary sputtering target, and ring sputtering targets, with purities ranging from 99.0% to 99.9999%.

Custom fabrication of most sputtering targets to any shape and size, based on provided drawings, is feasible. For sputtering targets with technical constraints on the maximum size of a single piece, segments can be joined using butt or angled joints to form a multi-segment sputtering target.

Should the required sputtering target materials/specifications not be listed, we encourage you to contact us.

What we can provide?

Metal Alloy Oxide Ceramic (Non-Oxide) Chalcogenide Precious Metal Rare Earth Halide Compound
Al AlCo Al₂O₃ AlN Bi₂Te₃ Ag Ce CsI ATO
Ba AlCr AlON B₄C BiSbTe AgCr CeGd InF₃ AZO
Bi AlCu CdO BN BiSbSe AgCu CeSm LiF FTO
Co AlMg Cu₂O Cr₂AlC CdS Au Er MgF₂ IGZO
Cu AlNi Fe₃O₄ CrSi₂ FeS Ir Gd PbCl₂ ITO
Fe AlSi Ga₂O₃ GaN GeS₂ IrMn La YbF₃ IZO
Ge CoCr HfO₂ MgSi₂ MoS₂ Pd La₂O₃ KF YSZ
Hf CrNb In₂O₃ Mo₂C MoSe₂ PdAg La₂Zr₂O₇ ZnF₂ ZTO
In CrSiAl Li₂O MoSi₂ NbSe₂ PdNi LaB₆ MoCl₅ BaTiO₃
Li CuSn MoO₃ NbN SnS₂ Pt Sm NbCl₅ BaVO₃
Mg CuZn Nb₂O₅ Si₃N₄ ZnS Rh SmB₆ ZrF₄ BiFeO₃
Mn FeCrAl NiO SiC CdTe Ru SmCo BiVO₄
Mo MoNb Sb₂O₅ TaC ZnSe Tm   KNbO₃
Nb MoTa SiO TaN ZnTe   Y   Li₃PO₄
Ni MoW SiO₂ Ti₃SiC₂ CaSe   Yb   LiCoPO₄
Sb NbTi SnO₂ TiB₂ FeSe   Yb₂O₃   LiSiO₄
Sc NbZr Ta₂O₅ TiN Cu₂Te   YBCO   LiFePO₄
Se NiAl TiOx VN CuTe   YPO₄   MgTiO₃
Si NiCr V₂O₅ VSi₂ NiTe     MgSiO₃
Sn NiFe ZnO WC MoTe₂       SrTiO₃
Ta NiSi ZrO₂ WSi₂       SrNbO₃
Te NiV ZrB₂         ZnTiO₃
Ti SiFe   ZrC         ZrNbO₃
V TiAlSi          
W TiZr              
Zn WRe              
Zr WTi              
ZnSn              
               
 

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