Tungsten Tantalum alloy sputtering target is an alloy material composed of tungsten and tantalum with high melting point, high hardness, good electrical conductivity and thermal stability, which is able to deposit high-quality thin films effectively in the sputtering coating process, and it is widely used in the preparation of thin films in the fields of electronics, optics and aerospace.
Characteristic
Flexible element ratio: The ratio of tungsten to tantalum in tungsten tantalum sputtering targets can be adjusted according to specific needs, and different ratios will result in different target properties. For example, alloy targets with higher tungsten content may have higher hardness and melting point but lower plasticity, while targets with higher tantalum content may perform better in terms of corrosion resistance.
High purity requirements: In general, high quality tungsten tantalum sputtering targets require high purity, usually 99.9% and above, to ensure the quality and performance of sputtered films. The presence of impurities may affect the sputtering rate, film uniformity, and electrical and optical properties of the target.
High melting point: Tungsten has a melting point of approximately 3410°C and Tantalum has a melting point of approximately 2996°C. The alloys formed from these two materials also have high melting points. The high melting point makes the tungsten tantalum alloy sputtering target able to withstand high energy input during the sputtering process, and is not easy to melt and deform, which ensures the stability of sputtering and the service life of the target.
High density: The density of tungsten and tantalum is relatively high, the density of tungsten is about 19.35 g/cm³, and the density of tantalum is about 16.69 g/cm³, so tungsten tantalum alloy sputtering targets have high density. The high density helps to increase the energy and momentum of the sputtered particles, thus improving the deposition rate and quality of the film.
Good electrical conductivity: Both tungsten and tantalum have good electrical conductivity, which enables tungsten tantalum sputtering targets to conduct current effectively during the sputtering process, ensuring that the sputtering proceeds normally. Good electrical conductivity also helps to prepare thin films with excellent electrical properties.
High hardness: tungsten tantalum alloy combines the high hardness characteristics of tungsten and tantalum, and has high hardness. The high hardness makes the target material less susceptible to the impact and abrasion of sputtering particles during the sputtering process, and is able to maintain good surface flatness and dimensional accuracy, thus ensuring the uniformity and consistency of the film.
Better bending strength: tungsten tantalum alloy sputtering targets have better bending strength, can withstand certain bending stress, and are not easy to fracture and damage. This is very important for the processing, installation and use of the target.
Moderate sputtering rate: The sputtering rate of tungsten tantalum alloy sputtering targets depends on a variety of factors, such as sputtering power, gas pressure, the distance between the target and the substrate and so on. Generally speaking, the moderate sputtering rate of tungsten tantalum alloy sputtering target can not only ensure the deposition efficiency of the film, but also control the thickness and uniformity of the film.
High film quality: Due to the uniform composition, high purity and stable physical properties of tungsten tantalum alloy sputtering target, the sputtered film has high quality. The surface flatness of the film is good, the granularity is small, the defects are few, and it has good electrical, optical, mechanical and other properties.
Applications
Electronic semiconductor field:
Integrated circuit manufacturing: In the semiconductor chip manufacturing process, tungsten tantalum alloy sputtering targets can be used for the preparation of interconnect lines and barrier layer films, etc.. The semiconductor industry has very high requirements for the purity, precision and integration of targets. The high melting point, high hardness and good electrical conductivity of tungsten-tantalum alloy enable it to meet the stringent requirements of semiconductor manufacturing, and help to improve the performance and reliability of chips.
Manufacturing of electronic components: Tungsten Tantalum alloy can be used to manufacture electrodes or thin film materials for electronic components such as capacitors, resistors, etc., providing good electrical conductivity and stable physicochemical properties for electronic components.
Optical field:
Optical Coating:Tungsten Tantalum alloy is used to manufacture optical lenses, filters, mirrors and other optical devices with coating. Through sputtering coating technology, a layer of tungsten tantalum alloy film is deposited on the surface of the optical device, which can improve the reflectivity, transmittance, wear resistance and corrosion resistance of the optical device, thus improving the optical performance and service life of the optical device.
Flat panel display: In the manufacture of flat panel displays, tungsten tantalum alloy sputtering targets can be used to prepare electrode materials for thin film transistors (TFTs), as well as conductive films for liquid crystal displays (LCDs) and organic light-emitting diodes (OLEDs), which play an important role in improving flat panel displays’ performance in terms of resolution, brightness, contrast, and response speed.
Aerospace field:
High-temperature parts coating: some parts in the aerospace field need to work in extreme environments such as high temperature, high pressure and high speed, tungsten tantalum alloy sputtering targets can be used to prepare high-temperature protective coatings on the surfaces of these parts to improve the high-temperature resistance, oxidation resistance and corrosion resistance of the parts, thus ensuring the reliability and service life of the parts.
Aero-engine parts: For example, in the manufacture of key parts such as turbine blades and combustion chambers of aero-engine, tungsten tantalum alloy sputtering targets can be used to prepare wear-resistant and high-temperature-resistant coatings or thin films, which can improve the performance and service life of the parts.
Energy field:
Solar cells: Tungsten Tantalum alloy can be used as electrode materials or back reflection layer materials for solar cells, which helps to improve the photoelectric conversion efficiency and stability of solar cells.
Fuel Cells: In the manufacture of fuel cells, tungsten tantalum alloy sputtering targets can be used for the preparation of electrode materials or catalyst carriers for fuel cells, which provide good electrical conductivity and catalytic properties for fuel cells.
Mechanical processing field:
Tool Coating: It can be used to prepare hard coating on the surface of the tool to improve the hardness, wear resistance and cutting performance of the tool, so as to extend the service life of the tool and improve the machining efficiency.
Mould surface treatment: It is used for coating treatment on the surface of moulds, which can improve the surface hardness, abrasion resistance and demoulding performance of moulds, reduce the wear and damage of moulds, and improve the service life and productivity of moulds.
VI HALBLEITERMATERIAL GmbH (VIMATERIAL) employs a stringent quality assurance system to ensure the reliability of our product quality. Strict quality control is implemented throughout the entire production chain, and for defective products, we strictly enforce the principle of rework and redo. Each batch is released only after passing detailed specification tests.
Every batch of our materials is independently tested, and, if necessary, we send samples to certified companies for testing. We provide these documents and analysis certificates with the shipment to certify that our products meet the required standards.
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