Titanium Silicide

Titanium Silicide sputtering target is a material mainly composed of titanium and silicon for physical vapour deposition, usually in solid state, with specific chemical stability and suitable physical properties, in the sputtering process can deposit titanium and silicon atoms on the surface of the substrate, to form a thin film with good electrical and thermal properties, used in semiconductors, microelectronics, and many other fields.

We supply Titanium Silicide sputtering targets, VIMATERIAL can also provide target binding service, our products are subject to customisation and experimentation, please contact us if you need.

Characteristics

Molecular formula: TiSi₂.

Molecular weight: about 104.05

Appearance: Usually grey or black solid, with metallic luster

Density: about 4.3 – 4.9 g/cm³.

Melting point: about 1540°C

Crystal structure: belongs to the orthorhombic crystal system, in its crystal structure titanium atoms and silicon atoms are arranged according to a specific law, silicon atoms form a three-dimensional network structure, titanium atoms fill in the interstices of which, this structure makes it have a better thermal stability and electrical properties.

Applications

Semiconductor field:Titanium Silicide sputtering target is used as a metal silicide to form low-resistance contact layers and interconnect materials, which can effectively reduce the contact resistance of devices and improve the performance and speed of integrated circuits.

Microelectronic devices: It can be used as a diffusion barrier layer to prevent the diffusion of atoms between different metal layers, thus improving the stability and reliability of the device and extending the service life of the microelectronic device.

Photovoltaic industry: Titanium Silicide can be used as the contact electrode material for silicon-based solar cells, which helps to improve the photoelectric conversion efficiency of the cells and reduce energy loss.

High-temperature materials: Titanium Silicide is used in high-temperature structural materials and high-temperature electronic components, which can maintain the integrity and performance of the materials in high-temperature environments.

Optoelectronic Devices: Titanium Silicide can be used as an important component to improve the detection and conversion of optical signals in optoelectronic devices by taking advantage of its special electrical and optical properties.

Quality Control

Our products are subject to a strict quality management system. There are strict inspection standards for incoming materials, processing, final inspection and factory inspection. Strict isolation measures are taken for unqualified processing to prevent unqualified products from flowing into the next process. Samples are provided for customer re-inspection according to customer requirements.

Packaging and Storage

Titanium Silicide sputtering targets are packed in double-layer vacuum bags and then boxed, and packed in cartons.

Titanium Silicide sputtering targets should be stored in a dry, cool, well-ventilated and stable temperature environment to avoid moisture, oxidation, contamination with corrosive substances and drastic temperature changes, and it is best to use hermetically sealed packaging to ensure that its physical and chemical properties are not damaged.