Tin Telluride

Tin Telluride sputtering target is a material consisting of tin (Sn) and tellurium (Te) used in physical vapour deposition technology, usually solid, with a specific purity and density, capable of depositing thin films of tin telluride during sputtering, which are widely used in semiconductor, optoelectronic, thermoelectric and other fields.

Characteristics

Chemical formula: SnTe, consisting of two elements, tin (Sn) and tellurium (Te), with a fixed elemental ratio, ensuring the accuracy and stability of the film composition during the sputtering process.

Appearance: Usually grey in colour.

Density: approx. 6500 kg/m³. The higher density enables the target to provide sputtered particles more stably during the sputtering process, ensuring the uniformity and denseness of the film.

Melting point: 790°C. The relatively low melting point makes the energy required in the sputtering process low, but also requires care to avoid high temperatures during storage and use, so as to avoid melting or deformation of the target.

Grain size: has a small average grain size, which helps to improve the uniformity and performance of sputtered films. The uniformity of grain size is also important to ensure the consistency of the film when sputtering over a large area.

Crystal phase structure: Having a specific crystal phase structure, the stability of which affects the structure and properties of the sputtered film.

Sputtering rate: under certain sputtering conditions, a moderate sputtering rate can ensure efficient film preparation.

Film Thickness Uniformity: A good film thickness uniformity can be achieved, making the thickness of the sputtered film on the substrate uniformly distributed, which is very important for some applications that require high film thickness accuracy.

Adhesion: Good adhesion between the sputtered film and the substrate ensures that the film is not easily detached or peeled off during use.

Applications

Semiconductor field:

IC manufacturing: In the manufacture of semiconductor integrated circuits, thin films can be prepared, e.g. as interconnect line material or barrier layer material. The electrical properties of tin telluride enable it to be used in semiconductor devices to conduct electricity, connect different components, etc., helping to improve the performance and integration of integrated circuits.

Semiconductor Device R&D: Used in the research and development of semiconductor devices, it helps researchers explore new semiconductor device structures and properties, and provides an experimental basis for the development of semiconductor technology.

Optical field:

Optical Coating: Thin films can be plated on the surface of optical lenses, optical windows, etc. to change their optical properties, such as increasing the reflectivity, transmittance or changing the refractive index. For example, in the manufacture of some special optical instruments, camera lenses and other optical components, tin telluride sputtering targets can be used to prepare thin films with specific optical properties to improve the performance and imaging quality of optical systems.

Infrared detectors: Tin telluride has unique optoelectronic properties and is suitable for the manufacture of sensitive materials for infrared detectors. Tin telluride thin films prepared by sputtering targets can improve the response speed, sensitivity and detection accuracy of infrared detectors, and have important applications in infrared thermal imaging, security monitoring, aerospace and other fields.

Thermoelectric field:

Preparation of thermoelectric materials: a promising thermoelectric material, tin telluride thin films or coatings prepared by sputtering targets can be used to fabricate thermoelectric conversion devices such as thermoelectric generators and thermoelectric coolers. These devices can directly convert thermal energy into electrical energy or achieve refrigeration effect, which has a broad application prospect in energy recovery, waste heat utilisation, heat dissipation of electronic equipment, etc.

Flat panel display field:

Flat panel display manufacturing: in the manufacturing process of flat panel displays, it can be used to prepare electrode materials for thin film transistors (TFTs) or other functional films. Tin telluride’s conductive properties and good film formability enable it to meet the requirements of flat panel displays for electrode materials, which helps to improve the resolution, brightness and contrast of the display and other properties.