Tin Silver Copper Alloy

Tin Silver Copper Alloy sputtering target is a sputtering target composed of three metals, tin, silver and copper, used in the physical vapour deposition (PVD) process, which is capable of depositing thin films with specific properties on the surface of a wide range of substrate materials, and can be used in many fields such as electronics and optics.

Characteristics

Composition ratio: Tin is the main component, silver and copper content is relatively small, the composition ratio will vary in different applications.

Density: Density varies slightly depending on the proportion of components, generally between 7.38-9.92 g/cm³.

Melting point: varies between 217-985°C. For example, some tin-silver-copper alloys have a melting point of 9.8 g/cm³.

Appearance: It is usually presented as a metallic solid, and can be processed into plates, rods, sheets, sputtering targets, powders and other forms.

Electrical properties: has a certain degree of conductivity, can play a conductive role in electronics, semiconductors and other fields of thin film preparation, but the specific conductivity by the proportion of components, processing technology and other factors.

Chemical properties: good corrosion resistance, but at high temperatures, high humidity, strong acids and alkalis and other specific environments may still occur to a certain extent of corrosion. Its solubility in water is extremely low.

Sputtering rate: During the sputtering process, due to its unique composition and structure, it has a high sputtering rate and is able to efficiently deposit thin films on the substrate.

Film quality: The films prepared with this sputtering target have good uniformity, densification and adhesion, which can meet the requirements for film quality in various high-end applications.

Applications

Electronics industry:

Semiconductor chip manufacturing: In the manufacturing process of semiconductor chips, tin silver copper alloy sputtering targets can be used to deposit thin films, which play a role in connecting lines and blocking layers. For example, in the multi-layer wiring structure, the thin film formed by sputtering of this target can realise the electrical connection between different layers, and has good conductivity and stability, which can meet the high requirements of semiconductor chips for circuit connection.

Electronic packaging: Electronic packaging is to encapsulate the chip and other electronic components to protect the chip and realise the connection with external circuits. Tin silver copper alloy sputtering targets can be used to deposit thin films on the surface of encapsulation materials to improve the reliability and heat dissipation performance of the package. For example, the deposition of tin-silver-copper alloy film on the encapsulation substrate can enhance the bonding force between the encapsulation substrate and the chip, while improving the heat dissipation effect of the encapsulation to ensure the stability of the chip in the working process.

Solar photovoltaic field: In the manufacture of solar cells, tin silver copper alloy sputtering targets can be used to prepare electrodes and conductive films. Its good conductivity and stability can improve the photoelectric conversion efficiency and stability of solar cells. For example, the deposition of tin silver copper alloy film on the front electrode of a solar cell can reduce the resistance of the electrode and improve the current collection efficiency; the deposition of the film on the back reflective layer of the cell can enhance the reflection of light and improve the light absorption efficiency of the solar cell.

Flat panel display field: in the manufacture of flat panel displays, such as liquid crystal displays (LCD), organic light-emitting diode displays (OLED), etc., tin silver copper alloy sputtering targets can be used for the preparation of electrodes, conductive layers and reflective layers and other thin films. These films have an important impact on the performance and picture quality of the display. For example, in OLED displays, tin-silver-copper alloy films can be used as electrode materials to provide good conductivity so that the display can work properly.

Welding field: Tin silver copper alloy itself is a commonly used welding material, and tin silver copper alloy sputtering target can form a uniform film at the welding site by sputtering to improve the quality and reliability of welding. For example, in the welding of electronic components, the use of tin-silver-copper alloy sputtering targets can achieve precise welding, reduce welding defects, and improve the strength and stability of welding.

Optical field: It can be used to prepare optical films, such as transmittance enhancement film and reflection film. Tin silver copper alloy films have specific optical properties, and the thickness and composition of the film can be adjusted as needed to achieve control of the characteristics of light reflection, refraction and absorption, which can be applied to optical lenses, optical instruments and other fields.

Aerospace: Aerospace equipment requires extremely high material performance, and tin silver copper alloy sputtering targets can be used to prepare wear-resistant, corrosion-resistant and high-temperature-resistant coatings on the surface of aerospace components. These coatings can improve the service life and reliability of parts and ensure the safe operation of aerospace equipment.