Tin Silver Alloy sputtering target is a material used in the sputtering deposition process, made from an alloy of tin and silver, with high purity and a variety of shapes and sizes. It is commonly used in electronic manufacturing, semiconductor manufacturing, coating production and nanotechnology to enhance the electrical conductivity and mechanical properties of products.
Characteristics
Density: The density of tin silver alloy sputtering targets varies according to the composition, for example, the density of a common tin silver alloy sputtering target may be around 7 – 8 g/cm³, but the specific value needs to be determined according to the actual proportion of the composition. Higher densities help to improve the sputtering efficiency and film uniformity of the target.
Grain size: high-quality tin silver alloy sputtering targets usually have small grain size and good grain size uniformity, which helps to improve the quality of sputtered films and performance stability. Grain sizes may be in the micron range or smaller.
Resistivity: Tin silver alloys inherently have good electrical conductivity, and their sputtering targets have relatively low resistivity. For example, under certain temperature and composition conditions, the resistivity may be in the range of 10-⁵ – 10-⁶ Ω・m, but the specific value will vary depending on the alloy composition and preparation process.
Hardness: Tin silver alloy sputtering targets have a moderate hardness, which ensures that they are not easily deformed or damaged during sputtering, but are also easy to process and handle. The hardness value may be around 100 – 200 HV on the Vickers scale.
Sputtering rate: Under certain sputtering process conditions, tin silver alloy sputtering targets have a certain sputtering rate, which is related to the composition and structure of the target, sputtering power, gas pressure and other factors. Normally, the sputtering rate may be in the range of tens to hundreds of nanometres per minute.
Applications
Electronics Manufacturing:
Printed circuit board (PCB) soldering: In the PCB manufacturing process, tin silver alloy sputtering forms a thin film that can be used in the soldering area. Its high mechanical strength ensures the firmness of the soldering, and its good electrical conductivity ensures the stable transmission of electronic signals. For example, the PCBs of high-end electronic products require extremely high soldering quality, and the tin-silver alloy sputtering film can meet such high soldering requirements.
Electronic encapsulation: Electronic encapsulation is an important part of protecting and connecting electronic components. Tin-silver alloy sputtering targets can be used to make encapsulation materials, provide good physical protection and electrical connection for electronic components, and improve the reliability and stability of electronic equipment.
Semiconductor manufacturing: In the manufacturing process of semiconductor chips, tin-silver alloy sputtering targets can be used to prepare metal interconnection layers, barrier layers and other structures. Its ability to achieve efficient electron transfer in semiconductor devices and good compatibility with other materials helps to improve the performance of semiconductor chips.
Optical field:
Optical coatings: can be used to manufacture coatings for optical lenses, filters and other optical elements. Tin silver alloy films can enhance the reflective, refractive or absorptive properties of optical elements to meet the needs of different optical applications. For example, in some special optical instruments, specific optical coatings are needed to improve light transmission efficiency or filter specific wavelengths of light, tin-silver alloy sputtering targets can provide high-quality coating materials.
Display technology: In liquid crystal display (LCD), organic light-emitting diode display (OLED) and other display technologies, tin-silver alloy sputtering targets can be used to prepare electrodes or conductive layers. Their good conductivity and uniform layer quality help to improve the resolution, contrast and response speed of display panels.
New energy field:
Solar cells: In the manufacture of solar cells, tin-silver alloy sputtering targets can be used to prepare electrodes or reflective layers. For example, in thin-film solar cells, tin silver alloy films can be used as electrode materials to improve the photoelectric conversion efficiency of the battery; in some solar cell structures, tin silver alloy reflective layer can enhance the reflection of light and improve the efficiency of solar energy absorption.
Lithium battery: The electrode material of lithium battery needs to have good conductivity and stability. Tin silver alloy sputtering target can be used to prepare the electrode coating of lithium batteries, improve the performance of the electrode, improve the charging and discharging efficiency and cycle life of lithium batteries.
Decoration and protection field:
Surface decoration: tin silver alloy films are formed on the surface of products through sputtering technology, which can give the products unique appearance effects, such as metallic luster and colour. For example, in the surface treatment of jewellery, high-grade watches and other luxury goods, the tin-silver alloy sputtering film layer can increase the beauty and value of the product.
Anti-corrosion and wear-resistant coating: Tin silver alloy has good corrosion resistance and wear resistance, and its sputtering film layer can be used as anti-corrosion and wear-resistant coating applied to the surface of metal products to prolong the service life of the products. For example, in the field of automotive parts, mechanical tools, etc., tin-silver alloy coating can improve the corrosion and wear resistance of products.
Nanotechnology field: In nanotechnology research and application, tin silver alloy sputtering targets can be used to prepare nanostructured materials or nanodevices. For example, tin-silver alloy nanoparticles, nanowires and other structures can be prepared by sputtering technology, and these nanomaterials have potential applications in the fields of sensors, catalysts and so on.
VI HALBLEITERMATERIAL GmbH (VIMATERIAL) employs a stringent quality assurance system to ensure the reliability of our product quality. Strict quality control is implemented throughout the entire production chain, and for defective products, we strictly enforce the principle of rework and redo. Each batch is released only after passing detailed specification tests.
Every batch of our materials is independently tested, and, if necessary, we send samples to certified companies for testing. We provide these documents and analysis certificates with the shipment to certify that our products meet the required standards.
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