Tantalum Tungsten Alloy

Tantalum Tungsten Alloy sputtering target is a sputtering target composed of two metal elements, tantalum (Ta) and tungsten (W), which is used in sputtering coating technology. It has the characteristics of high melting point, high strength, abrasion resistance, high temperature resistance, corrosion resistance, etc. It can be widely used as a key material in electronics, semiconductors, aerospace and aviation, machinery and many other fields.

Characteristic

Flexible element ratio: The ratio of tantalum to tungsten in tantalum tungsten alloy sputtering targets can be adjusted according to specific needs, and different ratios will result in different target properties. Generally speaking, the addition of tungsten enhances the strength and hardness of the alloy, but reduces the density and plasticity.

High Purity Requirements: High purity is often required, generally 99.9% and above, to minimise the effect of impurities on the performance of sputtered films. The presence of impurities may lead to a decrease in the electrical and optical properties of the film, affecting the quality and stability of the product.

High melting point: the melting point of tantalum is about 2996℃, and the melting point of tungsten is as high as 3410℃, and the melting point of the alloy formed by the two of them is also very high, which makes tantalum and tungsten alloy sputtering targets still remain stable under high temperature environment, and can be adapted to high-temperature conditions during sputtering, and is not easy to be melted or deformed.

High density: Tantalum and tungsten have relatively high densities, so tantalum tungsten sputtering targets have high densities. High density helps to improve the sputtering efficiency, so that the sputtered film is more uniform and dense.

Good electrical conductivity: metal materials generally have good electrical conductivity, tantalum tungsten alloy is no exception. Good electrical conductivity is conducive to the formation of a stable plasma in the sputtering process, improving the sputtering rate and the quality of the film.

High strength and hardness: combining the advantages of tantalum and tungsten, it has high strength and hardness, and is able to withstand ion bombardment and mechanical stress during sputtering, and is not prone to rupture or damage.

Good bending strength: when subjected to bending force, it has good resistance and is not easy to break, which is very important for the processing of the target and the installation during the use.

Corrosion resistance: tantalum itself has a strong resistance to chemical corrosion, except for a few substances such as hydrofluoric acid, sulphur trioxide, hot concentrated sulphuric acid and alkali, it can remain stable in most chemical environments. Tantalum tungsten alloy has high stability in acid and neutral medium, and its stability is even higher than that of gold foil at 200℃.

Antioxidant: under high temperature and oxidising atmosphere, it has better antioxidant property and is not easy to be oxidised, which can ensure the stability of sputtering process and the quality of thin film.

Applications

Electronic field:

Semiconductor manufacturing: In the process of semiconductor chip manufacturing, tantalum tungsten alloy sputtering targets can be used to deposit thin films, such as forming conductive thin films in the metallisation layer of integrated circuits, to improve the conductivity of the chip and the efficiency of signal transmission. Their high purity and good sputtering properties help ensure film uniformity and quality, which is crucial for manufacturing high-performance, high-reliability semiconductor chips.

Flat panel display: In liquid crystal display (LCD), organic light-emitting diode (OLED) and other flat panel display technologies, tantalum tungsten alloy sputtering targets are used to prepare electrodes, thin-film transistors (TFT) and other components. For example, in TFT-LCD, sputtering tantalum tungsten alloy films can form high-quality electrodes and circuit connections, improving the resolution, contrast and response speed of the display panel.

Electronic Packaging: Electronic packaging is the process of packaging semiconductor chips into complete electronic devices. Tantalum tungsten alloy sputtering targets can be used to deposit thin films on the surface of encapsulation materials to improve the electrical conductivity, thermal conductivity and corrosion resistance of the encapsulation materials, protect the chip from the external environment, and at the same time improve the reliability and performance of the electronic device.

Optical field:

Optical Coating: In the manufacture of optical devices such as optical lenses, optical lenses, lasers, etc., various optical films need to be coated on the surface to improve the optical performance. Tantalum tungsten alloy sputtering targets can be used to deposit thin films with specific optical properties, such as transmittance enhancement films, reflective films, filter films, etc. These films can improve the transmittance of optical devices. These films can improve the transmittance, reflectivity, refractive index and other properties of optical devices, and improve the imaging quality and efficiency of optical systems.

Laser technology: In lasers, tantalum tungsten alloy sputtering targets can be used to prepare laser gain media, mirrors and other components. For example, by sputtering tantalum tungsten alloy thin film can form a reflector with high reflectivity, improving the output power and stability of the laser.

Aerospace:

Coating of high-temperature components: Some components in the aerospace field need to work in harsh environments such as high temperature, high pressure and high speed, which requires extremely high performance of the materials. Tantalum tungsten alloy sputtering targets can be used to deposit high-temperature coatings on the surface of these components, such as thermal barrier coatings, antioxidant coatings, etc., to improve the components’ high-temperature resistance, antioxidant resistance and corrosion resistance, and to prolong the service life of the components.

Aero-engine components: Aero-engine turbine blades, combustion chambers and other components need to have good high-temperature strength, heat corrosion resistance and fatigue resistance. Tantalum tungsten alloy sputtering targets can be used to prepare coatings or parts for these components to improve the performance and reliability of aero-engines.

Energy field:

Solar cells: In the manufacture of solar cells, tantalum tungsten alloy sputtering targets can be used to prepare electrodes, back reflection layers and other components. For example, by sputtering tantalum tungsten alloy thin film can form a highly efficient back-reflective layer, improving the light absorption efficiency and conversion efficiency of solar cells.

Fuel cell: Fuel cell is an efficient and clean energy conversion device, which requires high conductivity, corrosion resistance and stability of materials. Tantalum tungsten alloy sputtering targets can be used to prepare electrodes, catalyst carriers and other components of fuel cells to improve the performance and life of fuel cells.

Mechanical processing field:

Tool coating: Tantalum tungsten alloy thin film plated on the surface of the tool can improve the hardness, wear resistance, corrosion resistance and cutting performance of the tool, and extend the service life of the tool. For example, in the high-speed steel tools, carbide tools and other surface plating tantalum tungsten alloy coating, can make it in high-speed cutting, dry cutting and other harsh processing conditions to maintain good performance.

Mould surface treatment: Moulds are susceptible to wear and tear, corrosion and thermal fatigue in the process of use, reducing the service life of moulds and productivity. By depositing tantalum tungsten alloy film on the surface of the mould, the surface hardness, abrasion resistance, corrosion resistance and demoulding performance of the mould can be improved, so as to improve the quality and productivity of the mould.