Silicon

Silicon wafers are particularly useful in manufacturing electronic circuits as substrates for chips. Silicon ranks seventh as the most common element in the entire universe and the second most common element on Earth. Silicon is currently the most widely used semiconductor in semiconductor technology.

Silicon wafers come in a variety of shapes and sizes, depending on their purpose. Wafers range from 2 inches to 12 inches, with 6 inches, 8 inches, and 12 inches being the most common.

VIMATERIAL can provide high-quality single crystal silicon wafers of various specifications, as well as single crystal silicon wafer processing and customization services.

• Growth method: CZ, FZ, etc.
• Size: 2”, 3”, 4”, 5”, 6”, 8”, 12” and special non-standard diameters and special-shaped silicon wafers;
• Surface: single polishing, double polishing, grinding, etc.;
• Orientation: <100>, <111>, <110> orientation and deflection angle and special orientation;
• Thickness: 50um-2mm, etc., commonly used thickness: 200um/500um/1mm
• Conductive type: N-type, P-type, intrinsic semi-insulating;
• Resistivity: heavily doped <0.001Ω.cm, lightly doped 1~100Ω.cm, non-doped >1000~>20000Ω.cm;

Silicon wafer manufacturing process:

Silicon (through reduction)–>Metallic silicon (through purification)–>Polycrystalline silicon (through heating and melting in a crucible)–>Molten silicon (through Czochralski method)–>Single crystal silicon rod (through wire knife cutting)–>Silicon wafer (through chemical mechanical grinding)–>Polished wafer (through heat treatment)–>Annealed wafer (through epitaxial growth)–>Epitaxial wafer (through a variety of processes)–>Manufacturing various integrated circuits or discrete devices