| Product ID | Formula | Purity | Dimension | Quantity | Price in € | Inquiry |
|---|---|---|---|---|---|---|
| 140801WF001 | SiO2 | 99.99% | Dia 2 inch x 285μm | 1 | POR | Inquire |
| 140801WF002 | SiO2 | 99.99% | Dia 4 inch x 285μm | 1 | POR | Inquire |
| 140801WF003 | SiO2 | 99.99% | Dia 4 inch x 285μm | 1 | POR | Inquire |
Silica wafers are widely used in semiconductor, microelectronics and research applications. Silicon wafers are the basic material for semiconductor devices and are covered with a layer of silicon dioxide with a thickness ranging from a few nanometers to tens of nanometers, which can act as an insulator and protect. The surface properties of the silicon dioxide layer have a great influence on the performance of the silicon wafer.
Base Material: Silicon wafer (Si) serves as the substrate.
Oxide Layer: A layer of silicon dioxide (SiO₂) is thermally grown or deposited on the silicon surface. The thickness of this oxide layer can vary based on requirements.
The silica wafers can be hydrophilic or hydrophobic, which exhibit different surface properties.
1. Hydrophilic Surface
If the surface energy is lower than the surface energy of the liquid, the surface is hydrophilic to the liquid. The silicon dioxide layer on the surface of the silicon wafer can exhibit a hydrophilic surface after being treated by some chemical methods. In this case, water molecules will form a liquid water film with a small wetting angle on the surface of the silicon wafer, which is conducive to some reactions, growth or analysis that interact with water.
2. Hydrophobic Surface
If the surface energy is higher than the surface energy of the liquid, the surface is hydrophobic to the liquid. The silicon dioxide layer on the surface of the silicon wafer usually exhibits hydrophobicity. In this case, water molecules form a water droplet at a large angle on the surface of the silicon wafer, which is not conducive to some reactions, growth or analysis that interact with water.
Microelectronics: Used in the fabrication of integrated circuits.
Research: Ideal for testing and development in labs and universities.
Optoelectronics: Foundational for devices that interact with light, like photodetectors and LEDs.
MEMS Devices: Essential for micro-electromechanical systems.
Dielectric Layers: SiO₂ acts as an insulating layer for various applications.
Surface Finish: Polished or roughened surfaces.
Double-sided or single-sided oxide layers.
Custom doping levels and wafer thickness.
VI HALBLEITERMATERIAL GmbH (VIMATERIAL) employs a stringent quality assurance system to ensure the reliability of our product quality. Strict quality control is implemented throughout the entire production chain, and for defective products, we strictly enforce the principle of rework and redo. Each batch is released only after passing detailed specification tests.
Every batch of our materials is independently tested, and, if necessary, we send samples to certified companies for testing. We provide these documents and analysis certificates with the shipment to certify that our products meet the required standards.
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