Molybdenum Tungsten Alloy

The Molybdenum Tungsten Alloy sputtering target is an alloy of molybdenum (Mo) and tungsten (W) that is specially designed for use in the sputtering process in physical vapour deposition (PVD). The composition of this alloy can be adapted to the specific needs of the application, with a combined molybdenum and tungsten content of nearly 100%.

Properties

Density and hardness: Molybdenum Tungsten Alloy has a high density of approximately 10.28 g/cm³ for molybdenum and 19.3 g/cm³ for tungsten, with the density of the alloy in between increasing with tungsten content. Its high hardness enables the target to withstand the bombardment of the ion beam during the sputtering process and maintain a stable shape without being easily deformed or damaged, helping to ensure the uniformity of the sputtered film.

Melting point and thermal conductivity: Molybdenum and tungsten both have high melting points of around 2623°C for molybdenum and 3422°C for tungsten, and molybdenum-tungsten alloys have inherited this characteristic, with high thermal stability. At the same time, the alloy also has a high thermal conductivity, which can effectively conduct the heat generated by ion bombardment during the sputtering process and prevent the target from overheating locally, thus extending the service life of the target.

Chemical stability: At room temperature, molybdenum-tungsten alloy sputtering target has good corrosion resistance to most chemical substances. It can resist the erosion of many acids, alkalis and other chemical reagents, but chemical reactions may occur under the action of some strong oxidising acids (such as concentrated nitric acid, aqua regia, etc.). In the common gas environment involved in the sputtering process (such as argon, nitrogen, etc.), the alloy target is chemically stable and can ensure the normal sputtering process.

Oxidation properties: In an aerobic environment at high temperatures, molybdenum and tungsten are subject to oxidation reactions. However, the effect of oxidation on the sputtering process and film quality can be reduced by proper sputtering process control (e.g. under high vacuum or reducing gas protection).

Applications

Electronics industry: Molybdenum Tungsten Alloy is used to deposit thin films of molybdenum-tungsten alloys as barrier or conductive layers in the manufacture of semiconductor devices. For example, in the metallisation process of integrated circuits, it prevents the diffusion of atoms between different metal layers, while providing good electrical conductivity to ensure the stable transmission of signals within the chip. It can also be used to manufacture electrode materials for electronic components, improving the performance and reliability of the components.

Thin Film Solar Cells: Molybdenum Tungsten Alloy is used to deposit a thin film of molybdenum-tungsten alloy on the electrodes or other functional layers of solar cells. Such films can improve the photoelectric conversion efficiency and stability of the cell. For example, in cadmium telluride (CdTe) thin film solar cells, molybdenum tungsten alloy films play an important role as the back electrode material.

Hard coating field: Molybdenum Tungsten Alloy can be used to sputter Molybdenum Tungsten Alloy thin films on the surface of tools, moulds, etc. to form hard wear-resistant coatings. These coatings can improve the service life of tools and moulds, enhance their wear resistance, corrosion resistance and high-temperature stability, and have a wide range of applications in machining, mould making and other industries.