Molybdenum Copper Alloy

Molybdenum Copper Alloy sputtering target is a kind of sputtering target composed of molybdenum and copper with good thermal conductivity and adjustable performance, etc. It can be prepared by powder metallurgy method or fusion casting method, etc., and can be made into a variety of specifications, which is widely used in electronics, optoelectronics and other multi-discipline sputtering targets.

Characteristics

Chemical formula: MoCu

Appearance: Usually metallic luster, color varies depending on the ratio of molybdenum to copper, generally between silver-gray and light red.

Thermal conductivity: Copper has excellent thermal conductivity, which enables the molybdenum copper alloy sputtering target to dissipate heat quickly during the sputtering process, helping to maintain the temperature stability of the target and the entire sputtering system, and preventing the deformation of the target and the degradation of the film properties caused by overheating.

Low expansion coefficient matching: The thermal expansion coefficient of molybdenum copper alloy can be adjusted by adjusting the ratio of molybdenum-copper to match a wide range of semiconductor and optical materials, which reduces the stress caused by the difference in thermal expansion in the process of preparing thin films, and thus improves the adhesion between the thin film and the substrate as well as the quality of the thin film.

Adjustable properties: By varying the ratio of molybdenum to copper, the physical and chemical properties of the alloy, such as hardness, resistivity, density, etc., can be adjusted within a certain range to meet the specific requirements of sputtered film properties for different application scenarios.

Applications

Electronics industry

Semiconductor manufacturing: In semiconductor chip manufacturing, molybdenum copper alloy sputtering targets are used to form key structures such as interconnects, barrier and contact layers in integrated circuits. Its good thermal conductivity helps to dissipate heat, preventing the chip from being damaged due to overheating during the working process; the thermal expansion coefficient matching with semiconductor materials can ensure a good combination between the film and the substrate, improving the reliability and performance of the chip.

Electronic Packaging: Used in the field of electronic packaging, such as the preparation of metallization layer on the packaging substrate to provide electrical connection and heat dissipation channel for the chip. The low resistivity and high thermal conductivity of molybdenum copper alloy can meet the requirements of electronic packaging for efficient electrical transmission and heat dissipation, while its adjustable performance can be adapted to the needs of different packaging materials and structures.

Optoelectronics

Flat-panel display manufacturing: In the production process of flat-panel displays (such as liquid crystal displays, organic light-emitting diode displays, etc.), molybdenum copper alloy sputtering targets can be used for the preparation of thin-film transistor (TFT) electrodes, source and drain, and other components, as well as transparent conductive and reflective films for displays. Its good conductivity and optical properties help improve the image quality, contrast and response speed of displays.

Solar cell manufacturing: It can be applied to the electrode preparation of solar cells to improve the photoelectric conversion efficiency and charge collection efficiency of the cells. The suitable work function and electrical properties of molybdenum copper alloys can optimize the transport process of electrons and holes in solar cells, thus enhancing the performance of the cells.

Other areas

Optical Coating: When coating the surface of optical components (such as lenses, filters, laser reflectors, etc.), molybdenum copper alloy sputtering targets can be used to form thin films with specific optical properties, such as anti-reflective films, high-reflective films, etc., in order to improve the optical properties of the optical components, such as increasing the transmittance, enhancing the reflectivity, etc., and to satisfy the needs of optical instruments and equipment in different application scenarios.

Decorative coating: In the decorative industry, molybdenum copper alloy sputtering targets can be used to prepare thin film coatings with metallic luster and decorative effects on base materials such as metals, plastics, ceramics, etc. Their rich colors (depending on the molybdenum-copper ratio) and good corrosion resistance make them widely used in decorative products (e.g., jewelry, clocks and watches, and the shells of electronic products, etc.), which provide the products with the dual functions of aesthetics and protection.