Magnesium Silicate

Magnesium Silicate Sputtering Target is a specialized form of magnesium silicate designed for use in thin-film deposition processes, such as sputtering. These targets are often fabricated as solid discs or other shapes, optimized for uniform material transfer in physical vapor deposition (PVD) systems, particularly in research, electronics, and optical applications.

Physical Properties:

Appearance: Generally gray to white in color, with a dense, uniform structure to ensure consistency in sputtering.

Purity: High purity, often ≥ 99.9%, is standard for most thin-film applications to avoid introducing impurities in the film.

Density: Varies by specific formulation but typically falls between 2.5 and 3.0 g/cm³, ensuring durability under high sputtering energies.

Melting Point: Around 1557°C (2835°F), though actual performance is governed by the target’s thermal conductivity and resilience under plasma bombardment.

Applications:

Optical Coatings: Magnesium silicate sputtering target is used to create thin films with optical properties suitable for anti-reflective or reflective coatings on glass and other substrates.

Semiconductor Manufacturing: Magnesium silicate sputtering target is utilized in the deposition of insulating or dielectric layers, contributing to circuit stability and reliability.

Thin-Film Transistors (TFT): Essential in electronics for creating specific insulating or passivation layers in TFTs and other microelectronic devices.

Protective Coatings: Provides corrosion-resistant or wear-resistant coatings for various mechanical and optical components.

Handling and Safety:

Storage: Targets should be stored in a clean, dry environment to avoid contamination before use.

Precautions: Magnesium silicate dust may be harmful if inhaled; thus, handling precautions, including the use of protective equipment, are recommended during preparation and installation.