Catalogries

Chemical Name:
Hafnium Boride
Formula:
HfB2
Product No.:
720500
CAS No.:
12007-23-7
EINECS No.:
234-500-7
Form:
Sputtering Target
HazMat:

MSDS

TDS

Product ID Formula Purity Dimension Quantity Price in € Inquiry
720500ST001 HfB2 99.5% (Hf+Zr) Ø 50.8 mm x 3.175 mm 1 POR Inquire
720500ST002 HfB2 99.5% (Hf+Zr) Ø 76.2 mm x 3.175 mm 1 POR Inquire
720500ST003 HfB2 99.5% (Hf+Zr) Ø 76.2 mm x 6.35 mm 1 POR Inquire
720500ST004 HfB2 99.5% (Hf+Zr) Ø 101.6 mm x 6.35 mm 1 POR Inquire
Product ID
720500ST001
Formula
HfB2
Purity
99.5% (Hf+Zr)
Dimension
Ø 50.8 mm x 3.175 mm
Quantity
1
Price in €
POR
Product ID
720500ST002
Formula
HfB2
Purity
99.5% (Hf+Zr)
Dimension
Ø 76.2 mm x 3.175 mm
Quantity
1
Price in €
POR
Product ID
720500ST003
Formula
HfB2
Purity
99.5% (Hf+Zr)
Dimension
Ø 76.2 mm x 6.35 mm
Quantity
1
Price in €
POR
Product ID
720500ST004
Formula
HfB2
Purity
99.5% (Hf+Zr)
Dimension
Ø 101.6 mm x 6.35 mm
Quantity
1
Price in €
POR

Hafnium Boride sputtering target is a solid material consisting of the elements hafnium (Hf) and boron (B) used in sputtering deposition technology for the preparation of thin films, which have important applications in many high-tech fields such as semiconductors, optics, wear-resistant coatings, etc. It is a key functional material that possesses the characteristics of high hardness, high melting point and good chemical stability.

Characteristics

Appearance: usually appears as a dark grey solid.

Melting point: up to 3150 ℃ (some data show that it is about 3250 ℃), belongs to the high melting point materials, which makes it still can maintain a stable physical state in the high temperature environment, suitable for the application of high temperature sputtering process scenarios.

Density: The theoretical density is about 10.50g/cm³, high density helps to form a uniform, dense film during the sputtering process.

Hardness: Higher hardness and brittleness ensures both wear resistance and stability of the sputtering target during use and the need for careful handling during processing, transport and installation to avoid damage to the target.

Solubility: insoluble in water, which makes the target less susceptible to the influence of water during storage and use, ensuring the stability of its performance.

Chemical stability: at room temperature, except for hydrofluoric acid (HF), it hardly reacts with other common chemical reagents and has good chemical stability. However, it will react in concentrated hydrochloric acid and concentrated nitric acid mixtures.

Purity: In general, high quality hafnium boride sputtering targets are available in purities of 99.5% and higher. High purity helps reduce the effect of impurities on the performance of sputtered films.

Film uniformity: the ability to form a uniform film thickness distribution on the substrate, which is very important for the preparation of high-quality thin-film devices, such as in the semiconductor, optical and other fields, uniform film thickness can ensure the performance and reliability of the device.

Sputtering efficiency: With high sputtering efficiency, it can form the required thickness of film in a shorter time to improve production efficiency.

Bonding force: Through proper bonding process, a good bonding force can be formed between the target material and the backing plate to ensure that the target material will not fall off from the backing plate during the sputtering process and ensure the stability of the sputtering process.

Applications

 

Electronics and semiconductor field:

Integrated circuit manufacturing: In the semiconductor chip manufacturing process, hafnium boride sputtering targets can be used to deposit thin films, for example, as a barrier material for metal interconnect layers, preventing the mutual diffusion of different metal layers and ensuring the stability and reliability of the circuit. With the continuous development of semiconductor technology, the integration of the chip and performance requirements are increasingly high, hafnium boride because of its excellent performance in the advanced process of semiconductor chip manufacturing has a potential application value.

Electronic packaging: in the electronic packaging segment, can use hafnium boride sputtering target prepared film to improve the performance of packaging materials, such as enhancing the hardness of the packaging material, wear resistance and corrosion resistance, to protect the chip from the effects of the external environment.

 

Optical field:

Optical Coating: can be used to prepare optical films, such as transmittance enhancement films and reflective films. These films can be applied to optical devices such as optical lenses, lenses, lasers, etc. to improve the performance of optical devices. For example, in lasers, high reflective films prepared using hafnium boride sputtering targets can improve the reflective efficiency of lasers and enhance the output power of lasers.

Display technology: In flat panel display, liquid crystal display and other display technologies, hafnium boride sputtering targets can be used to prepare a variety of functional films, such as electrode films, insulating films. These films play an important role in improving the resolution, contrast, response speed and other properties of display devices.

 

High temperature protective coating field:

Aerospace components: the aerospace field requires extremely high temperature performance of materials. Hafnium boride sputtering targets can be used to prepare high-temperature protective coatings on the surfaces of aerospace components, such as engine blades, combustion chambers and other parts. These coatings can effectively improve the components of high temperature resistance, oxidation resistance and corrosion resistance, to extend the service life of the components.

Industrial gas turbines: Industrial gas turbines generate high-temperature environments during operation, requiring the use of high-temperature-resistant materials and coatings to protect components. Coatings prepared by hafnium boride sputtering targets can be applied to blades, impellers and other key components of gas turbines to improve the efficiency and reliability of gas turbines.

 

New energy field:

Solar cells: In the manufacture of solar cells, hafnium boride sputtering targets can be used to prepare electrode materials or as encapsulation materials for cells. Its good conductivity and stability can improve the conversion efficiency and stability of solar cells.

Fuel cells: The key components of fuel cells, such as electrodes and electrolyte membranes, need to have good conductivity and chemical stability. Thin films prepared by hafnium boride sputtering targets can be applied to the electrodes of fuel cells to improve the performance and life of fuel cells.

 

Wear-resistant materials field: due to the high hardness and wear resistance of hafnium boride, coatings prepared using its sputtering target can be applied to a variety of components that require wear resistance, such as cutting tools, moulds, mechanical parts and so on. These coatings can improve the wear resistance of components and extend their service life.

Recommended Product

QUALITY ASSURANCE

VI HALBLEITERMATERIAL GmbH (VIMATERIAL) employs a stringent quality assurance system to ensure the reliability of our product quality. Strict quality control is implemented throughout the entire production chain, and for defective products, we strictly enforce the principle of rework and redo. Each batch is released only after passing detailed specification tests.

Every batch of our materials is independently tested, and, if necessary, we send samples to certified companies for testing. We provide these documents and analysis certificates with the shipment to certify that our products meet the required standards.

Need More Help?

Contact our team of experts today and let us help you with your business!

Contact Us

Contact Us

Contact Us