Catalogries

Chemical Name:
Aluminum Tin Copper Alloy
Formula:
AlSnCu
Product No.:
13502900
CAS No.:
EINECS No.:
Form:
Sputtering Target
HazMat:

MSDS

TDS

Product ID Formula Purity Dimension Quantity Price in € Inquiry
13502900ST001 AlSnCu 99.9% Ø 152mm x 9.8mm 1 POR Inquire
13502900ST002 AlSnCu 99.9% Ø 152mm x 9.8mm 1 POR Inquire
Product ID
13502900ST001
Formula
AlSnCu
Purity
99.9%
Dimension
Ø 152mm x 9.8mm
Quantity
1
Price in €
POR
Product ID
13502900ST002
Formula
AlSnCu
Purity
99.9%
Dimension
Ø 152mm x 9.8mm
Quantity
1
Price in €
POR

An Aluminum Tin Copper (Al-Sn-Cu) alloy target is a specialized alloy composed of aluminum (Al), tin (Sn), and copper (Cu), commonly used in thin-film deposition processes such as sputtering or evaporation. This alloy combines the properties of each metal to provide a balance of lightweight, wear resistance, and thermal stability, making it suitable for various applications, especially in the electronics and automotive sectors.

 

Characteristics of Aluminum Tin Copper Alloy Targets:

Composition: Aluminum Tin Copper targets typically contain varying proportions of the three elements, with aluminum often serving as the base metal. Tin provides lubrication properties, while copper contributes strength, hardness, and thermal conductivity. Common compositions vary depending on the application requirements but often involve a higher percentage of aluminum.

Purity: High-purity Aluminum Tin Copper targets, generally with purities of 99.9% or above, are preferred in electronics and other applications requiring minimal contamination to ensure high-quality, defect-free film formation.

Structure and Microstructure: Aluminum Tin Copper alloy targets are manufactured to be dense and have a uniform, fine-grained structure, which is essential for consistent material deposition. A homogeneous microstructure is particularly important for smooth and uniform thin-film applications.

 

Physical and Mechanical Properties:

Density: The density of the Aluminum Tin Copper alloy is influenced by the proportions of each metal, but the alloy typically maintains a lightweight profile, especially when aluminum is the primary component.

Thermal Conductivity: The presence of copper significantly enhances thermal conductivity, aiding in heat dissipation, which is valuable in electronic and automotive applications.

Lubricity: Tin imparts self-lubricating properties to the alloy, reducing friction in components that undergo sliding or rotational motion.
Wear Resistance: The combination of copper and tin improves the alloy’s wear resistance, making it suitable for surfaces that experience friction.

 

Applications:

Al-Sn-Cu alloy targets are used in several sectors, including:

Electronics: for creating thin films in circuit boards, capacitors, and other components where thermal management and stability are needed.

Automotive: in bearings, bushings, and other engine components where wear resistance and lubrication are critical.

Aerospace: in lightweight, wear-resistant coatings that must also withstand high thermal and mechanical stress.

Industrial Coatings: where thin films of Aluminum Tin Copper are used to enhance surface durability and reduce wear.

 

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QUALITY ASSURANCE

VI HALBLEITERMATERIAL GmbH (VIMATERIAL) employs a stringent quality assurance system to ensure the reliability of our product quality. Strict quality control is implemented throughout the entire production chain, and for defective products, we strictly enforce the principle of rework and redo. Each batch is released only after passing detailed specification tests.

Every batch of our materials is independently tested, and, if necessary, we send samples to certified companies for testing. We provide these documents and analysis certificates with the shipment to certify that our products meet the required standards.

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