Copper Metal

Copper Metal Backing Plate is a kind of backsheet mainly made of copper metal, which has good electrical conductivity, thermal conductivity and mechanical strength, with flat surface, and can provide reliable physical support, electromagnetic shielding, and efficient heat conduction for electronic devices, and plays an important role in photovoltaic, electronic communication and other fields.

Copper Backing Plate from VIMARERIAL are characterised by high transmission rates, low cost, high efficiency, good heat dissipation, flexible cabling and reduced transmission losses.

Why use copper as the target material for the Backing Plate?

Thermal conductivity: Copper is used as a backsheet because of its excellent thermal conductivity, which can quickly remove the heat generated by the target during sputtering, preventing the target from overheating and ensuring the stability of the sputtering process.

Conductivity: Because copper metal has good conductivity, it can ensure effective ion bombardment and charge transfer under high voltage and high vacuum sputtering environments, which is conducive to stable sputtering and ensuring film quality.

Mechanical strength: copper metal has enough mechanical strength to provide solid support for the target material, resist the mechanical stress and impact during sputtering, and prevent the target material from deformation or rupture.

Processing performance: copper is easy to process into various shapes and sizes, which is convenient for manufacturing backsheets with different requirements, and its binding process with the target material is mature, which ensures a tight connection and heat conduction.

Cost factor: copper cost is relatively low and abundant, using it as backsheet can reduce the overall cost of sputtering targets while ensuring the performance, which is conducive to large-scale industrial production.

Re-use: Copper backsheets can be re-used many times if properly maintained and only need to be checked for compliance with performance indicators, which further reduces production costs.

Copper as Backing Platet binding method?

Brazing: The lower melting point brazing material is melted by heating, filling the gap between the copper backsheet and the target material, and forming a solid connection after cooling, including conventional brazing and induction brazing.

Diffusion Soldering: Under specific temperature, pressure and time, atoms on the contact surfaces of the copper backsheet and the target material are allowed to diffuse into each other to achieve a tight connection.

Mechanical bonding:

Bolted connection: Screw holes are provided at the edges of the copper backsheet and the target material, which are fastened with bolts, nuts and washers, with gaskets to ensure tightness and thermal conduction.

Clamping device: use special fixture to clamp the copper backing plate and target material, apply clamping force to make them fit, pay attention to the pressure uniformity.

Gluing: Use good conductive and high temperature resistant glue to bond the copper backsheet and target material, simple operation but high demand for glue.

Thermal isostatic pressure: in the high temperature and high pressure environment to make the copper backplane and target material tightly combined, can eliminate interface porosity and defects.

Laser welding: Using high energy laser beam to focus on the connection part, make the material melt to form a joint, welding speed and strict parameter control.