{"id":1056198,"date":"2026-09-08T15:05:15","date_gmt":"2026-09-08T07:05:15","guid":{"rendered":"https:\/\/vimaterial.de\/?p=1056198"},"modified":"2026-09-08T15:07:35","modified_gmt":"2026-09-08T07:07:35","slug":"why-do-ito-sputtering-targets-crack-or-explode","status":"publish","type":"post","link":"https:\/\/vimaterial.de\/en\/why-do-ito-sputtering-targets-crack-or-explode\/","title":{"rendered":"Why Do ITO Sputtering Targets Crack or Explode? Sintering Structure and Stress Control Explained"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"1056198\" class=\"elementor elementor-1056198\" data-elementor-post-type=\"post\">\n\t\t\t\t<div class=\"elementor-element elementor-element-3749ffd e-flex e-con-boxed e-con e-parent\" data-id=\"3749ffd\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-8fd7b53 elementor-widget elementor-widget-text-editor\" data-id=\"8fd7b53\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"color: #0000ff;\"><a style=\"color: #0000ff;\" href=\"https:\/\/vimaterial.de\/en\/product\/indium-tin-oxide-ito-4\/\">ITO (Indium Tin Oxide) sputtering targets<\/a><\/span> are widely used to produce transparent conductive films for displays, touch panels, photovoltaic devices, and other optoelectronic applications. During magnetron sputtering, however, ITO targets may develop cracks, chipping, abnormal arcing, or even sudden fracture, commonly referred to as <strong>ITO target cracking or \u201ctarget explosion\u201d.<\/strong> The phenomenon of ITO Sputtering Targets Crack is complex and multifaceted.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-1ebb2b4 elementor-widget elementor-widget-text-editor\" data-id=\"1ebb2b4\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>This failure is rarely caused by a single factor. It is usually related to the combined effects of <strong>sintered density, pore distribution, grain structure, residual stress, internal defects, target bonding, cooling conditions, and sputtering power.<\/strong><\/p><p>Understanding these relationships is essential for producing ITO targets that can withstand high-power sputtering and provide stable film deposition.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-2dfcbe2 elementor-widget elementor-widget-heading\" data-id=\"2dfcbe2\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">1. What Causes ITO Target Explosion?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e57da88 elementor-widget elementor-widget-text-editor\" data-id=\"e57da88\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>During magnetron sputtering, energetic ions continuously bombard the ITO target surface. The bombardment generates both thermal and mechanical loading.<\/p><p>If the target contains internal defects or residual stress, these loads can concentrate around weak regions and initiate microscopic cracks. Once a crack forms, repeated thermal cycling and ion bombardment can drive its propagation.<\/p><p>A simplified failure mechanism is:<\/p><p><strong>Internal defect \u2192 stress concentration \u2192 microcrack initiation \u2192 crack propagation \u2192 target fracture<\/strong><\/p><p>In severe cases, cracking may occur together with abnormal discharge or arcing. Target fragments can then contaminate the sputtering chamber or substrate, causing process interruption and reduced production yield.<\/p><p>Therefore, <span style=\"color: #0000ff;\"><a style=\"color: #0000ff;\" href=\"https:\/\/vimaterial.de\/en\/ito-sputtering-target-problems-and-solutions\/\">ITO target explosion<\/a><\/span> should be understood as a <strong>materials-structure and process-coupling problem<\/strong>, rather than simply a mechanical failure.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-78c5682 elementor-widget elementor-widget-text-editor\" data-id=\"78c5682\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Ultimately, addressing the issue of ITO Sputtering Targets Crack is vital for enhancing the reliability and performance of sputtering processes.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-8e3062c elementor-widget elementor-widget-heading\" data-id=\"8e3062c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">2. Why Sintering Structure Is Critical\uff1f<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e23f416 elementor-widget elementor-widget-text-editor\" data-id=\"e23f416\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>ITO targets are generally manufactured from an <span style=\"color: #0000ff;\"><a style=\"color: #0000ff;\" href=\"https:\/\/vimaterial.de\/en\/search\/?type=name&amp;keyword=ITO\">In\u2082O\u2083-SnO\u2082<\/a><\/span> ceramic system. The powder characteristics, forming process, sintering profile, and cooling process collectively determine the final microstructure.<\/p><p>Several parameters directly influence target reliability:<\/p><ul><li>Sintered density<\/li><li>Density uniformity<\/li><li>Porosity and pore distribution<\/li><li>Grain size and grain uniformity<\/li><li>Chemical composition<\/li><li>Internal defects<\/li><li>Residual stress<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-b31bd2b elementor-widget elementor-widget-text-editor\" data-id=\"b31bd2b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>A high average density alone does not guarantee a reliable target. A target can show a satisfactory overall density while still containing local low-density regions, pores, or weak interfaces.<\/p><p>These regions can become stress concentration points during sputtering.<\/p><p>For this reason, <strong>uniformity throughout the target is often more important than simply maximizing the average density.<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-85a8053 elementor-widget elementor-widget-heading\" data-id=\"85a8053\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">3. Uneven Density and Differential Shrinkage<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-799c293 elementor-widget elementor-widget-text-editor\" data-id=\"799c293\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>The problem can begin before sintering.<\/p><p>ITO powder must first be formed into a green body. Cold isostatic pressing (CIP) is often used because it can provide relatively uniform pressure and reduce density gradients.<\/p><p>However, powder filling, particle-size distribution, powder dispersion, and forming conditions can still produce differences in green density.<\/p><p>During sintering, regions with different initial densities may shrink at different rates.<\/p><p>The resulting process can be described as:<\/p><p><strong>Uneven powder packing \u2192 green-density gradient \u2192 differential shrinkage \u2192 residual stress \u2192 crack initiation<\/strong><\/p><p>This problem becomes increasingly important for large-area or thick ITO targets, where maintaining uniform density throughout the entire cross-section is more difficult.<\/p><p>To reduce density-related cracking, manufacturers should control:<\/p><ul><li>Powder particle-size distribution<\/li><li>Powder dispersion<\/li><li>Powder filling uniformity<\/li><li>Forming pressure<\/li><li>CIP conditions<\/li><li>Green-body density distribution<\/li><li>Sintering shrinkage behavior<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-5786723 elementor-widget elementor-widget-text-editor\" data-id=\"5786723\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>The objective is to produce a green body with <strong>consistent initial density<\/strong>, allowing more uniform densification during sintering.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-8347935 elementor-widget elementor-widget-heading\" data-id=\"8347935\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">4. Porosity and Internal Defects<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-05ef7a6 elementor-widget elementor-widget-text-editor\" data-id=\"05ef7a6\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Porosity is another major factor affecting target reliability.<\/p><p>During sintering, pores should progressively shrink and disappear as the material densifies. If organic residues, gases, or poorly dispersed powder remain inside the green body, however, pores may become trapped or develop into closed internal defects.<\/p><p>These defects are particularly problematic because they act as local stress concentrators.<\/p><p>Internal defects can also contribute to abnormal sputtering behavior and particle generation, which is closely related to <a href=\"https:\/\/vimaterial.de\/en\/ito-target-nodule-formation-during-sputtering\/\"><span style=\"color: #0000ff;\">ITO target nodule formation during sputtering.<\/span><\/a><\/p><p>Under sputtering conditions, thermal and mechanical loading is repeatedly applied to the target. A pore or weak region can therefore become the starting point for crack propagation.<\/p><p>The mechanism can be summarized as:<\/p><p><strong>Pore or internal defect \u2192 local stress concentration \u2192 microcrack \u2192 crack growth \u2192 target failure<\/strong><\/p><p>This is why surface inspection alone is insufficient for evaluating a high-performance ITO target. Internal integrity must also be considered.<\/p><p>Appropriate inspection methods can include density measurement, microscopic or SEM analysis, ultrasonic inspection, dimensional inspection, and chemical analysis.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-d379e1c elementor-widget elementor-widget-heading\" data-id=\"d379e1c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">5. Residual Stress and Thermal Shock<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-014280c elementor-widget elementor-widget-text-editor\" data-id=\"014280c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>One of the most important factors in target cracking is <strong>residual stress generated during heating and cooling.<\/strong><\/p><p>During sintering, different regions of a large ceramic body may experience different temperatures. During cooling, the material contracts as its temperature decreases.<\/p><p>If the surface and interior cool at different rates, differential thermal contraction occurs.<\/p><p>This produces a temperature-gradient-driven stress:<\/p><p><strong>Temperature gradient \u2192 differential thermal contraction \u2192 thermal stress \u2192 residual stress<\/strong><\/p><p>If the accumulated stress exceeds the local fracture resistance of the ceramic, cracks can initiate or existing microcracks can become unstable.<\/p><p>The cooling stage is therefore just as important as the heating stage.<\/p><p>Important parameters include:<\/p><ul><li>Heating rate<\/li><li>Cooling rate<\/li><li>Holding time<\/li><li>Target thickness<\/li><li>Target geometry<\/li><li>Furnace temperature uniformity<\/li><li>Sintering atmosphere<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-6fa5db0 elementor-widget elementor-widget-image\" data-id=\"6fa5db0\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"800\" height=\"449\" src=\"https:\/\/vimaterial.de\/wp-content\/uploads\/2026\/09\/Internal-defects-stress-concentration-and-crack-propagation-in-ITO-sputtering-targets.png\" class=\"attachment-large size-large wp-image-1056200\" alt=\"Internal defects, stress concentration and crack propagation in ITO sputtering targets crack - VIMATERIAL\" srcset=\"https:\/\/vimaterial.de\/wp-content\/uploads\/2026\/09\/Internal-defects-stress-concentration-and-crack-propagation-in-ITO-sputtering-targets.png 890w, https:\/\/vimaterial.de\/wp-content\/uploads\/2026\/09\/Internal-defects-stress-concentration-and-crack-propagation-in-ITO-sputtering-targets-300x169.png 300w, https:\/\/vimaterial.de\/wp-content\/uploads\/2026\/09\/Internal-defects-stress-concentration-and-crack-propagation-in-ITO-sputtering-targets-768x431.png 768w, https:\/\/vimaterial.de\/wp-content\/uploads\/2026\/09\/Internal-defects-stress-concentration-and-crack-propagation-in-ITO-sputtering-targets-600x337.png 600w\" sizes=\"(max-width: 800px) 100vw, 800px\" title=\"\">\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-49e583c elementor-widget elementor-widget-text-editor\" data-id=\"49e583c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Controlled cooling can reduce thermal gradients and minimize residual stress. Depending on the manufacturing process, a subsequent annealing treatment may also be used to relieve internal stress.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-6db385a elementor-widget elementor-widget-heading\" data-id=\"6db385a\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">6. Grain Size and Microstructural Uniformity<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-7c36d7e elementor-widget elementor-widget-text-editor\" data-id=\"7c36d7e\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"color: #0000ff;\"><a style=\"color: #0000ff;\" href=\"https:\/\/www.sciencedirect.com\/science\/article\/pii\/S2352492825029708?utm_source=chatgpt.com\" rel=\"nofollow noopener\" target=\"_blank\">Grain structure also affects the mechanical and sputtering behavior of ITO targets.<\/a><\/span><\/p><p>Excessive grain growth can reduce mechanical strength and change fracture behavior. At the other extreme, an excessively fine-grained structure increases grain-boundary density and may influence electrical properties and sputtering characteristics.<\/p><p>Therefore, the objective is not simply to obtain the smallest possible grains, but to achieve a <strong>controlled and uniform grain structure.<\/strong><\/p><p>Grain-size distribution is particularly important. Large variations in grain size can produce local differences in mechanical strength, thermal response, and sputtering behavior.<\/p><p>A properly controlled microstructure should balance:<\/p><p><strong>Mechanical strength + electrical properties + sputtering stability<\/strong><\/p><p>This is especially important for targets intended for high-power or long-duration sputtering.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-41b23d9 elementor-widget elementor-widget-heading\" data-id=\"41b23d9\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">7. Impurities and Abnormal Discharge<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-d162cc3 elementor-widget elementor-widget-text-editor\" data-id=\"d162cc3\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>High-purity raw materials are essential for ITO target manufacturing.<\/p><p>Impurities, foreign particles, organic residues, and other contaminants can introduce local compositional or structural abnormalities.<\/p><p>During magnetron sputtering, these abnormal regions may respond differently to electrical and thermal loading compared with the surrounding ITO matrix.<\/p><p>They can potentially become preferential locations for:<\/p><ul><li>Localized heating<\/li><li>Abnormal discharge<\/li><li>Arcing<\/li><li>Particle generation<\/li><li>Crack initiation<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-494e8dd elementor-widget elementor-widget-text-editor\" data-id=\"494e8dd\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Therefore, quality control should cover not only the chemical purity of In\u2082O\u2083 and SnO\u2082 powders but also cleanliness during mixing, forming, sintering, machining, and packaging.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-91bcc06 elementor-widget elementor-widget-heading\" data-id=\"91bcc06\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">8. How Sputtering Conditions Trigger Target Failure<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-785dc9e elementor-widget elementor-widget-text-editor\" data-id=\"785dc9e\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>A well-manufactured target can still experience cracking if the sputtering process generates excessive thermal stress.<\/p><p>During magnetron sputtering, energetic ions transfer energy to the target surface. A significant portion of this energy becomes heat.<\/p><p>If heat removal is insufficient, the target temperature can increase locally. Existing pores, microcracks, or residual stresses can then amplify the thermal response.<\/p><p>A typical process is:<\/p><p><strong>Ion bombardment \u2192 localized heating \u2192 thermal stress \u2192 crack propagation \u2192 arcing \u2192 target failure<\/strong><\/p><p>Sputtering parameters that can influence this process include:<\/p><ul><li>Applied power<\/li><li>Power density<\/li><li>Current and voltage<\/li><li>Working pressure<\/li><li>Gas composition<\/li><li>Sputtering duration<\/li><li>Cooling-water conditions<\/li><li>Thermal contact between target and backing plate<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-255d754 elementor-widget elementor-widget-text-editor\" data-id=\"255d754\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Therefore, target quality and sputtering parameters must be evaluated together.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-afa42e3 elementor-widget elementor-widget-heading\" data-id=\"afa42e3\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">9. Why High-Power Sputtering Increases the Risk<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-68d9293 elementor-widget elementor-widget-text-editor\" data-id=\"68d9293\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Higher-power sputtering is increasingly used to improve deposition rates and production efficiency. However, increasing power also increases the thermal load applied to the target.<\/p><p>This places greater demands on:<\/p><ul><li>Target density<\/li><li>Mechanical strength<\/li><li>Thermal conductivity<\/li><li>Microstructural uniformity<\/li><li>Thermal-shock resistance<\/li><li>Cooling efficiency<\/li><li>Target bonding quality<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-82c3ded elementor-widget elementor-widget-text-editor\" data-id=\"82c3ded\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>A target that performs well under conventional power conditions may show abnormal arcing or cracking when power density is significantly increased.<\/p><p>This is why high-power sputtering requires not only a high-density ITO target, but also <strong>uniform structure and effective thermal management.<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3495746 elementor-widget elementor-widget-heading\" data-id=\"3495746\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">10. Target Bonding and Cooling<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3d751ec elementor-widget elementor-widget-text-editor\" data-id=\"3d751ec\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>The ceramic target itself is not the only component involved in thermal management.<\/p><p>In a typical sputtering assembly, heat must travel from the ITO target through the bonding layer and backing plate to the cooling system.<\/p><p>Poor thermal contact can create localized temperature differences and increase thermal stress.<\/p><p>Potential problems include:<\/p><ul><li>Uneven bonding-layer thickness<\/li><li>Voids in the bonding layer<\/li><li>Poor thermal contact<\/li><li>Insufficient cooling<\/li><li>Local overheating<\/li><li>Excessive thermal cycling<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-597b262 elementor-widget elementor-widget-text-editor\" data-id=\"597b262\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Therefore, target reliability should be evaluated as a complete assembly:<\/p><p><strong>ITO target \u2192 bonding layer \u2192 backing plate \u2192 cooling system<\/strong><\/p><p>Good thermal contact helps maintain a more uniform target temperature and reduces the probability of thermally induced cracking.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-7c470e6 elementor-widget elementor-widget-heading\" data-id=\"7c470e6\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">11. How to Prevent ITO Target Explosion<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-fd23bfd elementor-widget elementor-widget-text-editor\" data-id=\"fd23bfd\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Preventing target failure requires coordinated control from powder preparation through sputtering.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3aafd4b elementor-widget elementor-widget-heading\" data-id=\"3aafd4b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">11.1 Control Powder Quality<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3121aa6 elementor-widget elementor-widget-text-editor\" data-id=\"3121aa6\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Use high-purity In\u2082O\u2083 and SnO\u2082 powders with controlled particle-size distribution, good dispersion, and uniform Sn distribution.<\/p><p>Important parameters include:<\/p><ul><li>Chemical purity<\/li><li>Particle-size distribution<\/li><li>Specific surface area<\/li><li>Powder morphology<\/li><li>Composition uniformity<\/li><li>Moisture and impurity levels<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-9ca8fce elementor-widget elementor-widget-heading\" data-id=\"9ca8fce\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">11.2 Improve Green-Body Density Uniformity<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-05a6290 elementor-widget elementor-widget-text-editor\" data-id=\"05a6290\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>The forming process should minimize density gradients.<\/p><p>CIP can help achieve more uniform compaction, while powder filling and pressing conditions should be optimized according to target geometry.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-fb4cdc6 elementor-widget elementor-widget-heading\" data-id=\"fb4cdc6\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">11.3 Optimize the Sintering Profile<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-7fbf870 elementor-widget elementor-widget-text-editor\" data-id=\"7fbf870\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>The sintering schedule should provide controlled binder removal, densification, grain growth, and cooling.<\/p><p>A typical process concept is:<\/p><p><strong>Binder removal \u2192 controlled heating \u2192 densification \u2192 controlled cooling \u2192 optional annealing<\/strong><\/p><p>The exact temperature profile should be determined according to powder characteristics, target dimensions, furnace configuration, and material composition rather than using one fixed recipe for all targets.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-5170bbd elementor-widget elementor-widget-heading\" data-id=\"5170bbd\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">11.4 Control Microstructure<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-ace69fa elementor-widget elementor-widget-text-editor\" data-id=\"ace69fa\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>The finished target should have:<\/p><ul><li>High and uniform density<\/li><li>Low and uniformly distributed porosity<\/li><li>Controlled grain size<\/li><li>Uniform composition<\/li><li>Minimal internal defects<\/li><li>Low residual stress<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-10fa835 elementor-widget elementor-widget-image\" data-id=\"10fa835\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"800\" height=\"449\" src=\"https:\/\/vimaterial.de\/wp-content\/uploads\/2026\/09\/ITO-sputtering-targets-sintering-structure-and-microstructure.png\" class=\"attachment-large size-large wp-image-1056201\" alt=\"ITO sputtering targets sintering structure and microstructure - VIMATERIAL\" srcset=\"https:\/\/vimaterial.de\/wp-content\/uploads\/2026\/09\/ITO-sputtering-targets-sintering-structure-and-microstructure.png 890w, https:\/\/vimaterial.de\/wp-content\/uploads\/2026\/09\/ITO-sputtering-targets-sintering-structure-and-microstructure-300x169.png 300w, https:\/\/vimaterial.de\/wp-content\/uploads\/2026\/09\/ITO-sputtering-targets-sintering-structure-and-microstructure-768x431.png 768w, https:\/\/vimaterial.de\/wp-content\/uploads\/2026\/09\/ITO-sputtering-targets-sintering-structure-and-microstructure-600x337.png 600w\" sizes=\"(max-width: 800px) 100vw, 800px\" title=\"\">\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-6ba02df elementor-widget elementor-widget-heading\" data-id=\"6ba02df\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">11.5 Optimize Bonding and Cooling<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-b3c9730 elementor-widget elementor-widget-text-editor\" data-id=\"b3c9730\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>The bonding layer should provide reliable mechanical attachment and efficient heat transfer. Cooling conditions should also be sufficient to prevent excessive target temperature and thermal gradients.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-57051c1 elementor-widget elementor-widget-heading\" data-id=\"57051c1\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">12. How to Evaluate ITO Target Quality?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-39471f2 elementor-widget elementor-widget-text-editor\" data-id=\"39471f2\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>A reliable quality-control system should combine several inspection methods.<\/p><table><thead><tr><th>Quality Parameter<\/th><th>Evaluation Method<\/th><\/tr><\/thead><tbody><tr><td>Sintered Density<\/td><td>Density measurement<\/td><\/tr><tr><td>Grain Structure<\/td><td>SEM \/ Microscopic analysis<\/td><\/tr><tr><td>Internal Defects<\/td><td>Ultrasonic inspection<\/td><\/tr><tr><td>Surface Condition<\/td><td>Visual inspection<\/td><\/tr><tr><td>Chemical Purity<\/td><td>Chemical analysis<\/td><\/tr><tr><td>Dimensions<\/td><td>Dimensional inspection<\/td><\/tr><tr><td>Residual Stress<\/td><td>Process and stress evaluation<\/td><\/tr><\/tbody><\/table><p>The most effective approach is to establish a correlation between <strong>manufacturing parameters and inspection results.<\/strong><\/p><p>For example, recurring internal defects can be traced back to powder dispersion, forming density, or sintering conditions. Abnormal grain growth can be correlated with sintering temperature and holding time.<\/p><p>This creates a closed-loop process:<\/p><p><strong>Powder properties \u2192 Forming density \u2192 Sintering \u2192 Microstructure \u2192 Inspection \u2192 Process optimization<\/strong><\/p><p>Such a system helps manufacturers move from simply detecting defective targets toward predicting and preventing potential failures.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-4510a55 elementor-widget elementor-widget-heading\" data-id=\"4510a55\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">13. ITO Target Explosion as a Coupled Materials Problem<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-ca0e7b8 elementor-widget elementor-widget-text-editor\" data-id=\"ca0e7b8\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>ITO target cracking should not be attributed to a single parameter such as density or sputtering power.<\/p><p>The complete failure chain can be represented as:<\/p><p><strong>Powder quality<\/strong><br \/><strong>\u2193<\/strong><br \/><strong>Green-body density uniformity<\/strong><br \/><strong>\u2193<\/strong><br \/><strong>Sintering and cooling<\/strong><br \/><strong>\u2193<\/strong><br \/><strong>Density + porosity + grain structure<\/strong><br \/><strong>\u2193<\/strong><br \/><strong>Residual stress and internal defects<\/strong><br \/><strong>\u2193<\/strong><br \/><strong>Machining and bonding<\/strong><br \/><strong>\u2193<\/strong><br \/><strong>Thermal load during sputtering<\/strong><br \/><strong>\u2193<\/strong><br \/><strong>Arcing \/ crack propagation<\/strong><br \/><strong>\u2193<\/strong><br \/><strong>Target failure<\/strong><\/p><p>This explains why simply increasing the average density of an ITO target does not necessarily eliminate cracking.<\/p><p>A reliable target requires a combination of <strong>high density, structural uniformity, controlled porosity, appropriate grain size, low residual stress, high purity, and effective thermal management.<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e836ab3 elementor-widget elementor-widget-heading\" data-id=\"e836ab3\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Conclusion<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-66b7074 elementor-widget elementor-widget-text-editor\" data-id=\"66b7074\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>ITO target explosion is a complex failure phenomenon involving <strong>sintering structure, density uniformity, porosity, grain size, residual stress, internal defects, bonding conditions, cooling, and sputtering parameters.<\/strong><\/p><p>Among these factors, sintering quality is particularly important because it determines the target&#8217;s initial mechanical and thermal stability.<\/p><p>A high-performance ITO target should therefore achieve not only high density, but also <strong>uniform density, controlled pore distribution, homogeneous grain structure, low residual stress, high purity, and minimal internal defects.<\/strong><\/p><p>As sputtering processes move toward larger target sizes and higher power densities, precise control of these parameters becomes increasingly important.<\/p><p>Ultimately, the key to preventing ITO target cracking is not a single process adjustment, but a complete manufacturing and sputtering control system that connects <strong>powder preparation, forming, sintering, cooling, machining, bonding, inspection, and process optimization.<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-bedc3d1 elementor-widget elementor-widget-heading\" data-id=\"bedc3d1\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Frequently Asked Questions<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-f187569 elementor-widget elementor-widget-n-accordion\" data-id=\"f187569\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;default_state&quot;:&quot;expanded&quot;,&quot;max_items_expended&quot;:&quot;one&quot;,&quot;n_accordion_animation_duration&quot;:{&quot;unit&quot;:&quot;ms&quot;,&quot;size&quot;:400,&quot;sizes&quot;:[]}}\" data-widget_type=\"nested-accordion.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"e-n-accordion\" aria-label=\"Accordion. Open links with Enter or Space, close with Escape, and navigate with Arrow Keys\">\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-2530\" class=\"e-n-accordion-item\" open>\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"1\" tabindex=\"0\" aria-expanded=\"true\" aria-controls=\"e-n-accordion-item-2530\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><div class=\"e-n-accordion-item-title-text\"> Why do ITO sputtering targets crack during sputtering? <\/div><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-minus\" viewBox=\"0 0 448 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M416 208H32c-17.67 0-32 14.33-32 32v32c0 17.67 14.33 32 32 32h384c17.67 0 32-14.33 32-32v-32c0-17.67-14.33-32-32-32z\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-plus\" viewBox=\"0 0 448 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M416 208H272V64c0-17.67-14.33-32-32-32h-32c-17.67 0-32 14.33-32 32v144H32c-17.67 0-32 14.33-32 32v32c0 17.67 14.33 32 32 32h144v144c0 17.67 14.33 32 32 32h32c17.67 0 32-14.33 32-32V304h144c17.67 0 32-14.33 32-32v-32c0-17.67-14.33-32-32-32z\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-2530\" class=\"elementor-element elementor-element-c1bb1ff e-con-full e-flex e-con e-child\" data-id=\"c1bb1ff\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-e05f378 elementor-widget elementor-widget-text-editor\" data-id=\"e05f378\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>ITO sputtering targets can crack because of a combination of uneven density, internal pores, residual stress, thermal gradients, microstructural defects, poor bonding, and excessive thermal loading during sputtering. Existing microcracks or weak regions can expand under repeated ion bombardment and thermal cycling.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-2531\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"2\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-2531\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><div class=\"e-n-accordion-item-title-text\"> What is the main cause of ITO target explosion? <\/div><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-minus\" viewBox=\"0 0 448 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M416 208H32c-17.67 0-32 14.33-32 32v32c0 17.67 14.33 32 32 32h384c17.67 0 32-14.33 32-32v-32c0-17.67-14.33-32-32-32z\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-plus\" viewBox=\"0 0 448 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M416 208H272V64c0-17.67-14.33-32-32-32h-32c-17.67 0-32 14.33-32 32v144H32c-17.67 0-32 14.33-32 32v32c0 17.67 14.33 32 32 32h144v144c0 17.67 14.33 32 32 32h32c17.67 0 32-14.33 32-32V304h144c17.67 0 32-14.33 32-32v-32c0-17.67-14.33-32-32-32z\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-2531\" class=\"elementor-element elementor-element-fbbe1c6 e-con-full e-flex e-con e-child\" data-id=\"fbbe1c6\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-48c15f4 elementor-widget elementor-widget-text-editor\" data-id=\"48c15f4\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>There is usually no single cause. Uneven sintered density, internal defects, residual thermal stress, and insufficient heat dissipation are major contributors. High sputtering power or power density can further increase thermal stress and trigger crack propagation or abnormal arcing.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-2532\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"3\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-2532\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><div class=\"e-n-accordion-item-title-text\"> Can rapid cooling cause ITO target cracking? <\/div><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-minus\" viewBox=\"0 0 448 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M416 208H32c-17.67 0-32 14.33-32 32v32c0 17.67 14.33 32 32 32h384c17.67 0 32-14.33 32-32v-32c0-17.67-14.33-32-32-32z\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-plus\" viewBox=\"0 0 448 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M416 208H272V64c0-17.67-14.33-32-32-32h-32c-17.67 0-32 14.33-32 32v144H32c-17.67 0-32 14.33-32 32v32c0 17.67 14.33 32 32 32h144v144c0 17.67 14.33 32 32 32h32c17.67 0 32-14.33 32-32V304h144c17.67 0 32-14.33 32-32v-32c0-17.67-14.33-32-32-32z\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-2532\" class=\"elementor-element elementor-element-3f6b8b8 e-con-full e-flex e-con e-child\" data-id=\"3f6b8b8\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-25dcf9c elementor-widget elementor-widget-text-editor\" data-id=\"25dcf9c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Yes. Rapid or uneven cooling can generate temperature gradients between different regions of the ITO target. Because ceramic materials undergo thermal contraction during cooling, these gradients can produce residual stress and increase the risk of microcrack formation or crack propagation.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-2533\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"4\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-2533\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><div class=\"e-n-accordion-item-title-text\"> How can I prevent ITO target explosion during sputtering? <\/div><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-minus\" viewBox=\"0 0 448 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M416 208H32c-17.67 0-32 14.33-32 32v32c0 17.67 14.33 32 32 32h384c17.67 0 32-14.33 32-32v-32c0-17.67-14.33-32-32-32z\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-plus\" viewBox=\"0 0 448 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M416 208H272V64c0-17.67-14.33-32-32-32h-32c-17.67 0-32 14.33-32 32v144H32c-17.67 0-32 14.33-32 32v32c0 17.67 14.33 32 32 32h144v144c0 17.67 14.33 32 32 32h32c17.67 0 32-14.33 32-32V304h144c17.67 0 32-14.33 32-32v-32c0-17.67-14.33-32-32-32z\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-2533\" class=\"elementor-element elementor-element-e073a78 e-flex e-con-boxed e-con e-child\" data-id=\"e073a78\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-c0b4c15 elementor-widget elementor-widget-text-editor\" data-id=\"c0b4c15\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>ITO target failure can be reduced by controlling powder quality, green-body density, sintering and cooling conditions, grain structure, internal defects, target bonding, and cooling efficiency. During sputtering, appropriate power density, thermal management, and process stability are also important.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-2534\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"5\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-2534\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><div class=\"e-n-accordion-item-title-text\"> Does higher ITO target density always mean better sputtering performance? <\/div><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-minus\" viewBox=\"0 0 448 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M416 208H32c-17.67 0-32 14.33-32 32v32c0 17.67 14.33 32 32 32h384c17.67 0 32-14.33 32-32v-32c0-17.67-14.33-32-32-32z\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-plus\" viewBox=\"0 0 448 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M416 208H272V64c0-17.67-14.33-32-32-32h-32c-17.67 0-32 14.33-32 32v144H32c-17.67 0-32 14.33-32 32v32c0 17.67 14.33 32 32 32h144v144c0 17.67 14.33 32 32 32h32c17.67 0 32-14.33 32-32V304h144c17.67 0 32-14.33 32-32v-32c0-17.67-14.33-32-32-32z\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-2534\" class=\"elementor-element elementor-element-c81e74a e-flex e-con-boxed e-con e-child\" data-id=\"c81e74a\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-b81c11b elementor-widget elementor-widget-text-editor\" data-id=\"b81c11b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Not necessarily. High density is important, but target quality also depends on density uniformity, pore distribution, grain size, residual stress, chemical purity, and internal integrity. A highly dense target with significant internal stress or structural non-uniformity can still experience cracking or abnormal discharge.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-2388eee e-con-full e-flex e-con e-child\" data-id=\"2388eee\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-cab56dc elementor-widget elementor-widget-heading\" data-id=\"cab56dc\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">References<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3145bb7 elementor-icon-list--layout-traditional elementor-list-item-link-full_width elementor-widget elementor-widget-icon-list\" data-id=\"3145bb7\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"icon-list.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<ul class=\"elementor-icon-list-items\">\n\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">[1] Medvedovski, E., et al. (2008). Advanced indium-tin oxide ceramics for sputtering targets. Ceramics International, 34(5), 1173\u20131182.<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">[2] Comparing Microstructures of ITO Sputtering Targets Prepared by Tin Doped Indium Oxide Powders and In\u2082O\u2083-SnO\u2082 Mixed Powders. (2015). Rare Metal Materials and Engineering, 44(12), 2937\u20132942.<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">[3] Omata, T., Kita, M., Okada, H., Otsuka-Yao-Matsuo, S., Ono, N., &amp; Ikawa, H. (2006). Characterization of indium\u2013tin oxide sputtering targets showing various densities of nodule formation. Thin Solid Films, 503(1\u20132), 22\u201328.<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">[4] Effect of tin oxide dispersion on nodule formation in ITO sputtering. (2002). Vacuum, 66(3\u20134), 221\u2013226.<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">[5] Indium\u2013tin-oxide coatings for applications in photovoltaics and displays deposited using rotary ceramic targets: Recent insights regarding process stability and doping level. (2013). Thin Solid Films, 532, 94\u201397.<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t<\/ul>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-e6ce3f2 e-con-full e-flex e-con e-child\" data-id=\"e6ce3f2\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-9eb6552 elementor-widget elementor-widget-heading\" data-id=\"9eb6552\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">Further Reading<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-647f30a elementor-icon-list--layout-traditional elementor-list-item-link-full_width elementor-widget elementor-widget-icon-list\" data-id=\"647f30a\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"icon-list.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<ul class=\"elementor-icon-list-items\">\n\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/vimaterial.de\/en\/indium-tin-oxide-targets-ito\/\">\n\n\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-far-arrow-alt-circle-right\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M504 256C504 119 393 8 256 8S8 119 8 256s111 248 248 248 248-111 248-248zm-448 0c0-110.5 89.5-200 200-200s200 89.5 200 200-89.5 200-200 200S56 366.5 56 256zm72 20v-40c0-6.6 5.4-12 12-12h116v-67c0-10.7 12.9-16 20.5-8.5l99 99c4.7 4.7 4.7 12.3 0 17l-99 99c-7.6 7.6-20.5 2.2-20.5-8.5v-67H140c-6.6 0-12-5.4-12-12z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">Indium Tin Oxide Targets (ITO) \u2013 Overview of ITO target composition, properties, preparation, and applications.<\/span>\n\t\t\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/vimaterial.de\/en\/ito-target-nodule-formation-during-sputtering\/\">\n\n\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-far-arrow-alt-circle-right\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M504 256C504 119 393 8 256 8S8 119 8 256s111 248 248 248 248-111 248-248zm-448 0c0-110.5 89.5-200 200-200s200 89.5 200 200-89.5 200-200 200S56 366.5 56 256zm72 20v-40c0-6.6 5.4-12 12-12h116v-67c0-10.7 12.9-16 20.5-8.5l99 99c4.7 4.7 4.7 12.3 0 17l-99 99c-7.6 7.6-20.5 2.2-20.5-8.5v-67H140c-6.6 0-12-5.4-12-12z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">ITO Target Nodule Formation During Sputtering \u2013 Mechanisms and prevention of nodule formation during sputtering.<\/span>\n\t\t\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/vimaterial.de\/en\/ito-sputtering-target-problems-and-solutions\/\">\n\n\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-far-arrow-alt-circle-right\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M504 256C504 119 393 8 256 8S8 119 8 256s111 248 248 248 248-111 248-248zm-448 0c0-110.5 89.5-200 200-200s200 89.5 200 200-89.5 200-200 200S56 366.5 56 256zm72 20v-40c0-6.6 5.4-12 12-12h116v-67c0-10.7 12.9-16 20.5-8.5l99 99c4.7 4.7 4.7 12.3 0 17l-99 99c-7.6 7.6-20.5 2.2-20.5-8.5v-67H140c-6.6 0-12-5.4-12-12z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">ITO Sputtering Target Problems and Solutions \u2013 Common ITO target problems and practical solutions.<\/span>\n\t\t\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t<\/ul>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-4bacd63 e-con-full e-flex e-con e-child\" data-id=\"4bacd63\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-d678ca9 elementor-widget elementor-widget-heading\" data-id=\"d678ca9\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Need High Quality ITO Sputtering Targers?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-b3eb951 elementor-widget elementor-widget-text-editor\" data-id=\"b3eb951\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>If you are looking for high-quality ITO sputtering targets for display, photovoltaic, touch-panel, or other transparent conductive film applications, contact us for available purity levels, target dimensions, bonding options, and customized solutions.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-797e654 e-con-full e-flex e-con e-child\" data-id=\"797e654\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-0edfc6b elementor-widget elementor-widget-button\" data-id=\"0edfc6b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-button-wrapper\">\n\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"#elementor-action%3Aaction%3Dpopup%3Aopen%26settings%3DeyJpZCI6MTAzNTA2NywidG9nZ2xlIjpmYWxzZX0%3D\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Request a Quote<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-d0a0fa6 elementor-widget elementor-widget-button\" data-id=\"d0a0fa6\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-button-wrapper\">\n\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"https:\/\/vimaterial.de\/en\/contact-us\/\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Contact Us<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>ITO (Indium Tin Oxide) sputtering targets are widely used to produce transparent conductive films for displays, touch panels, photovoltaic devices, and other optoelectronic applications. During magnetron sputtering, however, ITO targets may develop cracks, chipping, abnormal arcing, or even sudden fracture, commonly referred to as ITO target cracking or \u201ctarget explosion\u201d. The phenomenon of ITO Sputtering [&hellip;]<\/p>\n","protected":false},"author":5,"featured_media":1056200,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[307,333,340],"tags":[573,308,388],"class_list":["post-1056198","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-sputtering-target-materials","category-semiconductor-materials","category-thin-film-deposition","tag-ito-sputtering-target","tag-sputtering-targets","tag-technical-guides"],"acf":[],"_links":{"self":[{"href":"https:\/\/vimaterial.de\/en\/wp-json\/wp\/v2\/posts\/1056198","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/vimaterial.de\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/vimaterial.de\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/vimaterial.de\/en\/wp-json\/wp\/v2\/users\/5"}],"replies":[{"embeddable":true,"href":"https:\/\/vimaterial.de\/en\/wp-json\/wp\/v2\/comments?post=1056198"}],"version-history":[{"count":5,"href":"https:\/\/vimaterial.de\/en\/wp-json\/wp\/v2\/posts\/1056198\/revisions"}],"predecessor-version":[{"id":1056205,"href":"https:\/\/vimaterial.de\/en\/wp-json\/wp\/v2\/posts\/1056198\/revisions\/1056205"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/vimaterial.de\/en\/wp-json\/wp\/v2\/media\/1056200"}],"wp:attachment":[{"href":"https:\/\/vimaterial.de\/en\/wp-json\/wp\/v2\/media?parent=1056198"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/vimaterial.de\/en\/wp-json\/wp\/v2\/categories?post=1056198"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/vimaterial.de\/en\/wp-json\/wp\/v2\/tags?post=1056198"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}